Stocking distributor of Electronic Components
Email: [email protected]
| Manufacturer Part Number: | XC2VP4-5FGG456C |
|---|---|
| Manufacturer: | Xilinx Inc. |
| Product Category: | Embedded - FPGAs (Field Programmable Gate Array) |
| Available Quantity: | 9010 Pieces |
| Unit Price: | Quote by Email |
| Description: | IC FPGA 248 I/O 456FBGA |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Production Status (Lifecycle): | In Production |
| Delivery Time: | 1-2 Days |
| Date Code (D/C): | New |
| Datasheet Download: | XC2VP4-5FGG456C Datasheet |
| Internal Part Number | 898-XC2VP4-5FGG456C | |
| Manufacturer Lead time | 6-8 weeks | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | FG(G) and BG(G) Wire Bond 25/Jan/2013 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Manufacturer | Xilinx Inc. | |
| Series | Virtex®-II Pro | |
| Part Status | Active | |
| Number of LABs/CLBs | 752 | |
| Number of Logic Elements/Cells | 6768 | |
| Total RAM Bits | 516096 | |
| Number of I/O | 248 | |
| Number of Gates | - | |
| Voltage - Supply | 1.425 V ~ 1.575 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 85°C (TJ) | |
| Package / Case | 456-BBGA | |
| Supplier Device Package | 456-FBGA (23x23) | |
| Standard Package | 60 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Replacement Part | XC2VP4-5FGG456C | |
| Country of Origin | USA / JAPAN / Philippines / Malaysia | |
| MOQ | 1 Piece | |
| Picture / Image / Photo | Send via email | |
XC2VP4-5FGG456C is in stock for immediate shipping now. We are the distributor of Xilinx Inc. all series components. The condition of XC2VP4-5FGG456C is new and unused, you can buy XC2VP4-5FGG456C Xilinx Inc. with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for XC2VP4-5FGG456C.
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