| Manufacturer Part Number: | XC7Z045-1FBG676C |
|---|---|
| Manufacturer: | Xilinx Inc. |
| Product Category: | Embedded - System On Chip (SoC) |
| Available Quantity: | 9010 Pieces |
| Unit Price: | Quote by Email |
| Description: | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 350K Logic Cells 256KB 667MHz 676-FCBGA (27x27) |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Production Status (Lifecycle): | In Production |
| Delivery Time: | 1-2 Days |
| Date Code (D/C): | New |
| Datasheet Download: | XC7Z045-1FBG676C Datasheet |
| Internal Part Number | 898-XC7Z045-1FBG676C | |
| Manufacturer Lead time | 6-8 weeks | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | Powering Series 7 Xilinx FPGAs with TI Power Management Solutions | |
| Featured Product | Zynq®-7 SoC | |
| PCN Design/Specification | Zynq-7000 Datasheet Update 02/Jun/2014 Zynq-7000 AP Requirement 28/Sep/2015 | |
| PCN Assembly/Origin | Additional Wafer Fabrication 16/Dec/2013 Substrate Supplier Addition 03/Nov/2014 | |
| Online Catalog | Zynq™-7000 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - System On Chip (SoC) | |
| Manufacturer | Xilinx Inc. | |
| Series | Zynq®-7000 | |
| Packaging | Tray | |
| Part Status | Active | |
| Architecture | MCU, FPGA | |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | |
| MCU Flash | - | |
| MCU RAM | 256KB | |
| Peripherals | DMA | |
| Connectivity | CAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |
| Speed | 667MHz | |
| Primary Attributes | Kintex™-7 FPGA, 350K Logic Cells | |
| Operating Temperature | 0°C ~ 85°C (TJ) | |
| Package / Case | 676-BBGA, FCBGA | |
| Supplier Device Package | 676-FCBGA (27x27) | |
| Number of I/O | 130 | |
| Standard Package | 1 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Replacement Part | XC7Z045-1FBG676C | |
| Country of Origin | USA / JAPAN / Philippines / Malaysia | |
| MOQ | 1 Piece | |
| Picture / Image / Photo | Send via email | |
XC7Z045-1FBG676C is in stock for immediate shipping now. We are the distributor of Xilinx Inc. all series components. The condition of XC7Z045-1FBG676C is new and unused, you can buy XC7Z045-1FBG676C Xilinx Inc. with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for XC7Z045-1FBG676C.
| 63USC12000MEFCSN35X45 | 12000µF 63V Aluminum Capacitors Radial, Can - Snap-In 3000 Hrs @ 85°C | 63USC12000MEFCSN35X45.pdf | |
| GBA06DTAH | CONN EDGECARD 12POS R/A .125 SLD | GBA06DTAH.pdf | |
| R6011825XXYA | Diode Standard 1800V (1.8kV) 250A Chassis, Stud Mount DO-205AB, DO-9 | R6011825XXYA.pdf | |
| LAV35VBR39M | 390nH Unshielded Inductor 940mA 120 mOhm Max Radial | LAV35VBR39M.pdf | |
| MAX4598CWP+ | IC MULTIPLEXER DUAL 4X1 20SOIC | MAX4598CWP+.pdf | |
| CD74HCT670MTG4 | IC 4X4 REGISTER FILE 3ST 16SOIC | CD74HCT670MTG4.pdf | |
| 1393816-3 | General Purpose Relay DPDT (2 Form C) Socketable | 1393816-3.pdf | |
| PEC12DFDN | 24 Positions Header, Unshrouded, Breakaway Connector 0.100" (2.54mm) Through Hole Tin | PEC12DFDN.pdf | |
| 5442691 | 10 Position Wire to Board Terminal Block Horizontal with Board 0.138" (3.50mm) Through Hole | 5442691.pdf | |
| 696423-7 | Ring Terminal Connector 1/4 Stud Circular 14-16 AWG Crimp | 696423-7.pdf | |
| YC324-FK-07196KL | RES ARRAY 4 RES 196K OHM 2012 | YC324-FK-07196KL.pdf |