Stocking distributor of Electronic Components

XC7Z030-1FBG676I

XC7Z030-1FBG676I
Manufacturer Part Number:XC7Z030-1FBG676I
Manufacturer:
Product Category:Embedded - System On Chip (SoC)
Available Quantity:9010 Pieces
Unit Price:Quote by Email
Description:Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 125K Logic Cells 256KB 667MHz 676-FCBGA (27x27)
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL):3 (168 Hours)
Production Status (Lifecycle):In Production
Delivery Time:1-2 Days
Date Code (D/C):New
Datasheet Download: XC7Z030-1FBG676I Datasheet
XC7Z030-1FBG676I´s Parameters
Internal Part Number898-XC7Z030-1FBG676I
Manufacturer Lead time6-8 weeks
ConditionNew & Unused, Original Sealed
Product Training ModulesPowering Series 7 Xilinx FPGAs with TI Power Management Solutions
Featured ProductZynq®-7 SoC
PCN Design/SpecificationZynq-7000 Datasheet Update 02/Jun/2014
Zynq-7000 AP Requirement 28/Sep/2015
PCN Assembly/OriginAdditional Wafer Fabrication 16/Dec/2013
Substrate Supplier Addition 03/Nov/2014
CategoryIntegrated Circuits (ICs)
FamilyEmbedded - System On Chip (SoC)
ManufacturerXilinx Inc.
SeriesZynq®-7000
PackagingTray
Part StatusActive
ArchitectureMCU, FPGA
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
MCU Flash-
MCU RAM256KB
PeripheralsDMA
ConnectivityCAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed667MHz
Primary AttributesKintex™-7 FPGA, 125K Logic Cells
Operating Temperature-40°C ~ 100°C (TJ)
Package / Case676-BBGA, FCBGA
Supplier Device Package676-FCBGA (27x27)
Number of I/O130
Standard Package 1
Weight0.001 KG
ApplicationEmail for details
Replacement PartXC7Z030-1FBG676I
Country of OriginUSA / JAPAN / Philippines / Malaysia
MOQ1 Piece
Picture / Image / PhotoSend via email

XC7Z030-1FBG676I is in stock for immediate shipping now. We are the distributor of Xilinx Inc. all series components. The condition of XC7Z030-1FBG676I is new and unused, you can buy XC7Z030-1FBG676I Xilinx Inc. with us at a very low price and quick delivery.

Please kindly send us an email if you have any demands for XC7Z030-1FBG676I.

Related Components of XC7Z030-1FBG676I
0.047µF 1500V (1.5kV) Ceramic Capacitor X7R 2225 (5763 Metric) 0.225" L x 0.250" W (5.72mm x 6.35mm) 2225SC473KAJ1A.pdf
0.68µF Film Capacitor 250V 1000V (1kV) Polypropylene (PP), Metallized Radial 1.260" L x 0.512" W (32.00mm x 13.00mm) R75QR36804000J.pdf
0.22µF Film Capacitor 300V 850V Polypropylene (PP), Metallized Rectangular Box 1.319" L x 0.866" W (33.50mm x 22.00mm) BFC238602224.pdf
CONN EDGECARD 72POS DIP .156 SLD EBM36DRXS.pdf
12.352MHz HCMOS, TTL XO (Standard) Oscillator Through Hole 5V 26mA Standby (Power Down) MXO45-3C-12M3520.pdf
Buffer, Non-Inverting 4 Element 4 Bit per Element Push-Pull Output 48-TVSOP 74ALB16244DGVRG4.pdf
CONVERTER MOD DC/DC 18.5V 100W VI-B3N-MW-F1.pdf
CONN EDGECARD 85POS .050 THRUHL RBB85DYHD.pdf
19 Position Circular Connector Receptacle for Female Contacts Panel Mount, Flange Shielded DTS20F25-19BB.pdf
23 Position Socket Connector 0.200" (5.08mm) Through Hole Gold 310-83-123-01-609101.pdf
CONN IC DIP SOCKET 14POS TIN 14-6501-20.pdf
15 Circuit 0.325" (8.26mm) Barrier Block Connector, Screws 325320-15-0.pdf
RES SMD 107K OHM 0.1% 0.15W 0705 M55342K06B107BRWS.pdf