Stocking distributor of Electronic Components
Email: [email protected]
| Manufacturer Part Number: | XC7Z030-1FBG676C |
|---|---|
| Manufacturer: | Xilinx Inc. |
| Product Category: | Embedded - System On Chip (SoC) |
| Available Quantity: | 9050 Pieces |
| Unit Price: | Quote by Email |
| Description: | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 125K Logic Cells 256KB 667MHz 676-FCBGA (27x27) |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Moisture Sensitivity Level (MSL): | 4 (72 Hours) |
| Production Status (Lifecycle): | In Production |
| Delivery Time: | 1-2 Days |
| Date Code (D/C): | New |
| Datasheet Download: | XC7Z030-1FBG676C Datasheet |
| Internal Part Number | 898-XC7Z030-1FBG676C | |
| Manufacturer Lead time | 6-8 weeks | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | Powering Series 7 Xilinx FPGAs with TI Power Management Solutions | |
| Featured Product | Zynq®-7 SoC | |
| PCN Design/Specification | Zynq-7000 Datasheet Update 02/Jun/2014 Zynq-7000 AP Requirement 28/Sep/2015 | |
| PCN Assembly/Origin | Additional Wafer Fabrication 16/Dec/2013 Substrate Supplier Addition 03/Nov/2014 | |
| Online Catalog | Zynq™-7000 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - System On Chip (SoC) | |
| Manufacturer | Xilinx Inc. | |
| Series | Zynq®-7000 | |
| Packaging | Tray | |
| Part Status | Active | |
| Architecture | MCU, FPGA | |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | |
| MCU Flash | - | |
| MCU RAM | 256KB | |
| Peripherals | DMA | |
| Connectivity | CAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |
| Speed | 667MHz | |
| Primary Attributes | Kintex™-7 FPGA, 125K Logic Cells | |
| Operating Temperature | 0°C ~ 85°C (TJ) | |
| Package / Case | 676-BBGA, FCBGA | |
| Supplier Device Package | 676-FCBGA (27x27) | |
| Number of I/O | 130 | |
| Standard Package | 1 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Replacement Part | XC7Z030-1FBG676C | |
| Country of Origin | USA / JAPAN / Philippines / Malaysia | |
| MOQ | 1 Piece | |
| Picture / Image / Photo | Send via email | |
XC7Z030-1FBG676C is in stock for immediate shipping now. We are the distributor of Xilinx Inc. all series components. The condition of XC7Z030-1FBG676C is new and unused, you can buy XC7Z030-1FBG676C Xilinx Inc. with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for XC7Z030-1FBG676C.
| C0805C681K1GACTU | 680pF 100V Ceramic Capacitor C0G, NP0 0805 (2012 Metric) 0.079" L x 0.049" W (2.00mm x 1.25mm) | C0805C681K1GACTU.pdf | |
| CPPLC7Z-A7B6-22.1184TS | 22.1184MHz CMOS XO (Standard) Oscillator Surface Mount 5V 45mA Enable/Disable | CPPLC7Z-A7B6-22.1184TS.pdf | |
| M93S66-WMN6T | IC EEPROM 4KBIT 2MHZ 8SO | M93S66-WMN6T.pdf | |
| C503B-BCN-CU0Y0462-030 | Blue 470nm LED Indication - Discrete 3.2V Radial | C503B-BCN-CU0Y0462-030.pdf | |
| REC5-2409DRWZ/H4/A/SMD-R | CONV DC/DC 5W 9-36VIN +/-09VOUT | REC5-2409DRWZ/H4/A/SMD-R.pdf | |
| MI-22J-MW-F2 | CONVERT DC/DC 28VIN 36VOUT 100W | MI-22J-MW-F2.pdf | |
| G4W-1114P-US-TV8-HP-DC12 | General Purpose Relay SPST-NO (1 Form A) 12VDC Coil Through Hole | G4W-1114P-US-TV8-HP-DC12.pdf | |
| RMCF1206FT5M60 | RES SMD 5.6M OHM 1% 1/4W 1206 | RMCF1206FT5M60.pdf | |
| ACC06E-14S-6P(003) | 6 Position Circular Connector Plug, Male Pins Crimp Silver | ACC06E-14S-6P(003).pdf | |
| SFW18R-2STGE1LF | 18 Position FPC Connector Contacts, Top 0.039" (1.00mm) Surface Mount, Right Angle | SFW18R-2STGE1LF.pdf | |
| 32-1508-20 | CONN IC DIP SOCKET 32POS GOLD | 32-1508-20.pdf | |
| KE24515300J0G | 24 Position Terminal Block Header, Male Pins, Shrouded (4 Side) 0.200" (5.08mm) 90°, Right Angle Through Hole | KE24515300J0G.pdf | |
| 9C04021A4641FLHF3 | RES SMD 4.64K OHM 1% 1/16W 0402 | 9C04021A4641FLHF3.pdf | |
| RN70C6192FRE6 | RES 61.9K OHM 3/4W 1% AXIAL | RN70C6192FRE6.pdf |