Stocking distributor of Electronic Components
Email: [email protected]
| Manufacturer Part Number: | XC2S100-6FGG256C |
|---|---|
| Manufacturer: | Xilinx Inc. |
| Product Category: | Embedded - FPGAs (Field Programmable Gate Array) |
| Available Quantity: | 9010 Pieces |
| Unit Price: | Quote by Email |
| Description: | IC FPGA 196 I/O 256FBGA |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Production Status (Lifecycle): | In Production |
| Delivery Time: | 1-2 Days |
| Date Code (D/C): | New |
| Datasheet Download: | XC2S100-6FGG256C Datasheet |
| Internal Part Number | 898-XC2S100-6FGG256C | |
| Manufacturer Lead time | 6-8 weeks | |
| Condition | New & Unused, Original Sealed | |
| PCN Assembly/Origin | Assembly Site Addition 01/Jun/2015 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Manufacturer | Xilinx Inc. | |
| Series | Spartan®-II | |
| Part Status | Active | |
| Number of LABs/CLBs | 600 | |
| Number of Logic Elements/Cells | 2700 | |
| Total RAM Bits | 40960 | |
| Number of I/O | 176 | |
| Number of Gates | 100000 | |
| Voltage - Supply | 2.375 V ~ 2.625 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 85°C (TJ) | |
| Package / Case | 256-BGA | |
| Supplier Device Package | 256-FBGA (17x17) | |
| Standard Package | 90 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Replacement Part | XC2S100-6FGG256C | |
| Country of Origin | USA / JAPAN / Philippines / Malaysia | |
| MOQ | 1 Piece | |
| Picture / Image / Photo | Send via email | |
XC2S100-6FGG256C is in stock for immediate shipping now. We are the distributor of Xilinx Inc. all series components. The condition of XC2S100-6FGG256C is new and unused, you can buy XC2S100-6FGG256C Xilinx Inc. with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for XC2S100-6FGG256C.
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