Stocking distributor of Electronic Components
Email: [email protected]
| Manufacturer Part Number: | XC17S200APD8C |
|---|---|
| Manufacturer: | Xilinx Inc. |
| Product Category: | Memory - Configuration Proms for FPGAs |
| Available Quantity: | 9010 Pieces |
| Unit Price: | Quote by Email |
| Description: | IC PROM SER 200000 C-TEMP 8-DIP |
| Lead Free Status / RoHS Status: | Contains lead / RoHS non-compliant |
| Moisture Sensitivity Level (MSL): | |
| Production Status (Lifecycle): | Obsolete / Discontinued |
| Delivery Time: | 1-2 Days |
| Date Code (D/C): | New |
| Datasheet Download: | XC17S200APD8C Datasheet |
| Internal Part Number | 898-XC17S200APD8C | |
| Manufacturer Lead time | 6-8 weeks | |
| Condition | New & Unused, Original Sealed | |
| PCN Obsolescence/ EOL | Multiple Devices 13/Apr/2015 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory - Configuration Proms for FPGAs | |
| Manufacturer | Xilinx Inc. | |
| Series | - | |
| Packaging | Tube | |
| Part Status | Obsolete | |
| Programmable Type | OTP | |
| Memory Size | 2Mb | |
| Voltage - Supply | 3 V ~ 3.6 V | |
| Operating Temperature | 0°C ~ 70°C | |
| Package / Case | 8-DIP (0.300", 7.62mm) | |
| Supplier Device Package | 8-PDIP | |
| Standard Package | 50 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Replacement Part | XC17S200APD8C | |
| Country of Origin | USA / JAPAN / Philippines / Malaysia | |
| MOQ | 1 Piece | |
| Picture / Image / Photo | Send via email | |
XC17S200APD8C is in stock for immediate shipping now. We are the distributor of Xilinx Inc. all series components. The condition of XC17S200APD8C is new and unused, you can buy XC17S200APD8C Xilinx Inc. with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for XC17S200APD8C.
| K103M15X7RH53L2 | 10000pF 100V Ceramic Capacitor X7R Radial 0.157" L x 0.098" W (4.00mm x 2.50mm) | K103M15X7RH53L2.pdf | |
| CC1812JKNPOCBN152 | 1500pF 1000V (1kV) Ceramic Capacitor C0G, NP0 1812 (4532 Metric) 0.177" L x 0.125" W (4.50mm x 3.20mm) | CC1812JKNPOCBN152.pdf | |
| SIT9003AC-14-33DD-18.33111Y | OSC XO 18.33111MHZ SD 0.50% | SIT9003AC-14-33DD-18.33111Y.pdf | |
| ELJ-QF2N0ZF | 2nH Unshielded Multilayer Inductor 400mA 90 mOhm Max 0402 (1005 Metric) | ELJ-QF2N0ZF.pdf | |
| 3090R-152K | 1.5µH Unshielded Inductor 250mA 1.2 Ohm Max 2-SMD | 3090R-152K.pdf | |
| DS3153N+ | Telecom IC Line Interface Unit (LIU) 144-TECSBGA (13x13) | DS3153N+.pdf | |
| S25FL256SDSMFBG00 | IC FLASH 256MBIT CMOS SPI 16SOIC | S25FL256SDSMFBG00.pdf | |
| AT28C010E-12JI | IC EEPROM 1MBIT 120NS 32PLCC | AT28C010E-12JI.pdf | |
| MI-25V-IY-S | CONVERT DC/DC 155VIN 5.8VOUT 50W | MI-25V-IY-S.pdf | |
| MCR50JZHJ1R8 | RES SMD 1.8 OHM 5% 1/2W 2010 | MCR50JZHJ1R8.pdf | |
| 929665-09-18-I | 36 Positions Header, Unshrouded Connector 0.100" (2.54mm) Through Hole Gold | 929665-09-18-I.pdf | |
| 0387390153 | 4 Circuit 0.438" (11.12mm) Barrier Block Connector, Screws (Not Included) | 0387390153.pdf | |
| TNPW040212K3BEED | RES SMD 12.3KOHM 0.1% 1/16W 0402 | TNPW040212K3BEED.pdf |