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XA7Z030-1FBG484Q

XA7Z030-1FBG484Q
Manufacturer Part Number:XA7Z030-1FBG484Q
Manufacturer:
Product Category:Embedded - System On Chip (SoC)
Available Quantity:9010 Pieces
Unit Price:Quote by Email
Description:Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Automotive, AEC-Q100, Zynq®-7000 XA Kintex™-7 FPGA, 125K Logic Cells 256KB 667MHz 484-FCBGA (23x23)
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL):4 (72 Hours)
Production Status (Lifecycle):Obsolete / Discontinued
Delivery Time:1-2 Days
Date Code (D/C):New
Datasheet Download: XA7Z030-1FBG484Q Datasheet
XA7Z030-1FBG484Q´s Parameters
Internal Part Number898-XA7Z030-1FBG484Q
Manufacturer Lead time6-8 weeks
ConditionNew & Unused, Original Sealed
PCN Obsolescence/ EOLXA7Z030-1FBG484Q/XA7Z030-1FBG484I EOL Notice 7/Dec/2015
PCN Design/SpecificationZynq-7000 AP Requirement 28/Sep/2015
CategoryIntegrated Circuits (ICs)
FamilyEmbedded - System On Chip (SoC)
ManufacturerXilinx Inc.
SeriesAutomotive, AEC-Q100, Zynq®-7000 XA
PackagingTray
Part StatusObsolete
ArchitectureMCU, FPGA
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
MCU Flash-
MCU RAM256KB
PeripheralsDMA
ConnectivityCAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed667MHz
Primary AttributesKintex™-7 FPGA, 125K Logic Cells
Operating Temperature-40°C ~ 125°C (TJ)
Package / Case484-BBGA, FCBGA
Supplier Device Package484-FCBGA (23x23)
Number of I/O130
Standard Package 1
Weight0.001 KG
ApplicationEmail for details
Replacement PartXA7Z030-1FBG484Q
Country of OriginUSA / JAPAN / Philippines / Malaysia
MOQ1 Piece
Picture / Image / PhotoSend via email

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