| Manufacturer Part Number: | UCR10EVHJSR011 |
|---|---|
| Manufacturer: | Rohm Semiconductor |
| Product Category: | Chip Resistor - Surface Mount |
| Available Quantity: | 14010 Pieces |
| Unit Price: | Quote by Email |
| Description: | RES SMD 0.011 OHM 5% 1/3W 0805 |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Production Status (Lifecycle): | In Production |
| Delivery Time: | 1-2 Days |
| Date Code (D/C): | New |
| Datasheet Download: | UCR10EVHJSR011 Datasheet |
| Internal Part Number | 898-UCR10EVHJSR011 | |
| Manufacturer Lead time | 6-8 weeks | |
| Condition | New & Unused, Original Sealed | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Online Catalog | UCR10 Series | |
| Category | Resistors | |
| Family | Chip Resistor - Surface Mount | |
| Manufacturer | Rohm Semiconductor | |
| Series | UCR | |
| Packaging | Tape & Reel (TR) | |
| Part Status | Active | |
| Resistance (Ohms) | 0.011 | |
| Tolerance | ±5% | |
| Power (Watts) | 0.333W, 1/3W | |
| Composition | Thick Film | |
| Features | Automotive AEC-Q200, Current Sense | |
| Temperature Coefficient | 50/ +450ppm/°C | |
| Operating Temperature | -55°C ~ 155°C | |
| Package / Case | 0805 (2012 Metric) | |
| Supplier Device Package | 0805 | |
| Size / Dimension | 0.079" L x 0.049" W (2.00mm x 1.25mm) | |
| Height | 0.026" (0.65mm) | |
| Number of Terminations | 2 | |
| Standard Package | 5,000 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Replacement Part | UCR10EVHJSR011 | |
| Country of Origin | USA / JAPAN / Philippines / Malaysia | |
| MOQ | 1 Piece | |
| Picture / Image / Photo | Send via email | |
UCR10EVHJSR011 is in stock for immediate shipping now. We are the distributor of Rohm Semiconductor all series components. The condition of UCR10EVHJSR011 is new and unused, you can buy UCR10EVHJSR011 Rohm Semiconductor with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for UCR10EVHJSR011.
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