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Email: [email protected]
| Manufacturer Part Number: | TSW-107-23-G-S-006 |
|---|---|
| Manufacturer: | Samtec Inc. |
| Product Category: | Rectangular Connectors - Headers, Male Pins |
| Available Quantity: | 9010 Pieces |
| Unit Price: | Quote by Email |
| Description: | 7 Positions Header, Unshrouded Connector 0.100" (2.54mm) Through Hole Gold |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Production Status (Lifecycle): | In Production |
| Delivery Time: | 1-2 Days |
| Date Code (D/C): | New |
| Datasheet Download: | TSW-107-23-G-S-006 Datasheet |
| Internal Part Number | 898-TSW-107-23-G-S-006 | |
| Manufacturer Lead time | 6-8 weeks | |
| Condition | New & Unused, Original Sealed | |
| Category | Connectors, Interconnects | |
| Family | Rectangular Connectors - Headers, Male Pins | |
| Manufacturer | Samtec Inc. | |
| Series | TSW | |
| Packaging | Tube | |
| Part Status | Active | |
| Contact Type | Male Pin | |
| Connector Type | Header, Unshrouded | |
| Number of Positions | 7 | |
| Number of Positions Loaded | 6 | |
| Pitch | 0.100" (2.54mm) | |
| Number of Rows | 1 | |
| Row Spacing | - | |
| Contact Mating Length | 0.230" (5.84mm) | |
| Mounting Type | Through Hole | |
| Termination | Solder | |
| Fastening Type | - | |
| Features | - | |
| Contact Finish | Gold | |
| Contact Finish Thickness | 10µin (0.25µm) | |
| Color | Black | |
| Standard Package | 1 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Replacement Part | TSW-107-23-G-S-006 | |
| Country of Origin | USA / JAPAN / Philippines / Malaysia | |
| MOQ | 1 Piece | |
| Picture / Image / Photo | Send via email | |
TSW-107-23-G-S-006 is in stock for immediate shipping now. We are the distributor of Samtec Inc. all series components. The condition of TSW-107-23-G-S-006 is new and unused, you can buy TSW-107-23-G-S-006 Samtec Inc. with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for TSW-107-23-G-S-006.
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