Manufacturer Part Number: | TLV2760ID |
---|---|
Manufacturer: | Texas Instruments |
Product Category: | Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps |
Available Quantity: | 9210 Pieces |
Unit Price: | Quote by Email |
Description: | General Purpose Amplifier 1 Circuit Rail-to-Rail 8-SOIC |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
Production Status (Lifecycle): | In Production |
Delivery Time: | 1-2 Days |
Date Code (D/C): | New |
Datasheet Download: | TLV2760ID Datasheet |
Internal Part Number | 898-TLV2760ID | |
Manufacturer Lead time | 6-8 weeks | |
Condition | New & Unused, Original Sealed | |
Online Catalog | General Purpose | |
Category | Integrated Circuits (ICs) | |
Family | Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps | |
Manufacturer | Texas Instruments | |
Series | - | |
Packaging | Tube | |
Part Status | Active | |
Amplifier Type | General Purpose | |
Number of Circuits | 1 | |
Output Type | Rail-to-Rail | |
Slew Rate | 0.23 V/µs | |
Gain Bandwidth Product | 500kHz | |
-3db Bandwidth | - | |
Current - Input Bias | 3pA | |
Voltage - Input Offset | 550µV | |
Current - Supply | 20µA | |
Current - Output / Channel | 10.2mA | |
Voltage - Supply, Single/Dual (±) | 1.8 V ~ 3.6 V, ±0.9 V ~ 1.8 V | |
Operating Temperature | -40°C ~ 85°C | |
Mounting Type | Surface Mount | |
Package / Case | 8-SOIC (0.154", 3.90mm Width) | |
Supplier Device Package | 8-SOIC | |
Standard Package | 75 | |
Weight | 0.001 KG | |
Application | Email for details | |
Replacement Part | TLV2760ID | |
Country of Origin | USA / JAPAN / Philippines / Malaysia | |
MOQ | 1 Piece | |
Picture / Image / Photo | Send via email |
TLV2760ID is in stock for immediate shipping now. We are the distributor of Texas Instruments all series components. The condition of TLV2760ID is new and unused, you can buy TLV2760ID Texas Instruments with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for TLV2760ID.
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