Manufacturer Part Number: | TLV2254AQDG4 |
---|---|
Manufacturer: | Texas Instruments |
Product Category: | Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps |
Available Quantity: | 9010 Pieces |
Unit Price: | Quote by Email |
Description: | General Purpose Amplifier 4 Circuit Rail-to-Rail 14-SOIC |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
Production Status (Lifecycle): | In Production |
Delivery Time: | 1-2 Days |
Date Code (D/C): | New |
Datasheet Download: | TLV2254AQDG4 Datasheet |
Internal Part Number | 898-TLV2254AQDG4 | |
Manufacturer Lead time | 6-8 weeks | |
Condition | New & Unused, Original Sealed | |
Category | Integrated Circuits (ICs) | |
Family | Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps | |
Manufacturer | Texas Instruments | |
Series | LinCMOS™ | |
Packaging | Tube | |
Part Status | Discontinued | |
Amplifier Type | General Purpose | |
Number of Circuits | 4 | |
Output Type | Rail-to-Rail | |
Slew Rate | 0.12 V/µs | |
Gain Bandwidth Product | 200kHz | |
-3db Bandwidth | - | |
Current - Input Bias | 1pA | |
Voltage - Input Offset | 200µV | |
Current - Supply | 140µA | |
Current - Output / Channel | 50mA | |
Voltage - Supply, Single/Dual (±) | 2.7 V ~ 8 V, ±1.35 V ~ 4 V | |
Operating Temperature | -40°C ~ 125°C | |
Mounting Type | Surface Mount | |
Package / Case | 14-SOIC (0.154", 3.90mm Width) | |
Supplier Device Package | 14-SOIC | |
Standard Package | 50 | |
Weight | 0.001 KG | |
Application | Email for details | |
Replacement Part | TLV2254AQDG4 | |
Country of Origin | USA / JAPAN / Philippines / Malaysia | |
MOQ | 1 Piece | |
Picture / Image / Photo | Send via email |
TLV2254AQDG4 is in stock for immediate shipping now. We are the distributor of Texas Instruments all series components. The condition of TLV2254AQDG4 is new and unused, you can buy TLV2254AQDG4 Texas Instruments with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for TLV2254AQDG4.
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