Manufacturer Part Number: | TFSQ0402C0H1C1R9WT |
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Manufacturer: | TDK Corporation |
Product Category: | Thin Film Capacitors |
Available Quantity: | 9010 Pieces |
Unit Price: | Quote by Email |
Description: | 1.9pF Thin Film Capacitor 16V 01005 (0402 Metric) 0.016" L x 0.008" W (0.40mm x 0.20mm) |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
Production Status (Lifecycle): | Obsolete / Discontinued |
Delivery Time: | 1-2 Days |
Date Code (D/C): | New |
Datasheet Download: | TFSQ0402C0H1C1R9WT Datasheet |
Internal Part Number | 898-TFSQ0402C0H1C1R9WT | |
Manufacturer Lead time | 6-8 weeks | |
Condition | New & Unused, Original Sealed | |
Product Training Modules | Z-Match Thin Film Capacitor | |
Featured Product | TFSQ0402 Series | |
PCN Obsolescence/ EOL | TFSQ0402 Series 15/Aug/2013 TFSQ0402 Series 01/Dec/2015 | |
EDA / CAD Models | Download from Accelerated Designs | |
Category | Capacitors | |
Family | Thin Film Capacitors | |
Manufacturer | TDK Corporation | |
Series | TFSQ0402 | |
Packaging | Digi-Reel® | |
Part Status | Obsolete | |
Capacitance | 1.9pF | |
Tolerance | ±0.05pF | |
Voltage - Rated | 16V | |
Mounting Type | Surface Mount | |
Package / Case | 01005 (0402 Metric) | |
Operating Temperature | -55°C ~ 125°C | |
Features | General Purpose | |
Size / Dimension | 0.016" L x 0.008" W (0.40mm x 0.20mm) | |
Height - Seated (Max) | 0.009" (0.22mm) | |
Standard Package | 1 | |
Weight | 0.001 KG | |
Application | Email for details | |
Replacement Part | TFSQ0402C0H1C1R9WT | |
Country of Origin | USA / JAPAN / Philippines / Malaysia | |
MOQ | 1 Piece | |
Picture / Image / Photo | Send via email |
TFSQ0402C0H1C1R9WT is in stock for immediate shipping now. We are the distributor of TDK Corporation all series components. The condition of TFSQ0402C0H1C1R9WT is new and unused, you can buy TFSQ0402C0H1C1R9WT TDK Corporation with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for TFSQ0402C0H1C1R9WT.
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