Manufacturer Part Number: | TCFGB0J226M8R |
---|---|
Manufacturer: | Rohm Semiconductor |
Product Category: | Tantalum Capacitors |
Available Quantity: | 11010 Pieces |
Unit Price: | Quote by Email |
Description: | 22µF Molded Tantalum Capacitors 6.3V 1411 (3528 Metric) 0.138" L x 0.110" W (3.50mm x 2.80mm) |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
Production Status (Lifecycle): | In Production |
Delivery Time: | 1-2 Days |
Date Code (D/C): | New |
Datasheet Download: | TCFGB0J226M8R Datasheet |
Internal Part Number | 898-TCFGB0J226M8R | |
Manufacturer Lead time | 6-8 weeks | |
Condition | New & Unused, Original Sealed | |
EDA / CAD Models | Download from Accelerated Designs | |
Online Catalog | TCFG Series | |
Category | Capacitors | |
Family | Tantalum Capacitors | |
Manufacturer | Rohm Semiconductor | |
Series | TCFG | |
Packaging | Tape & Reel (TR) | |
Part Status | Active | |
Capacitance | 22µF | |
Tolerance | ±20% | |
Voltage - Rated | 6.3V | |
ESR (Equivalent Series Resistance) | - | |
Type | Molded | |
Operating Temperature | -55°C ~ 125°C | |
Mounting Type | Surface Mount | |
Package / Case | 1411 (3528 Metric) | |
Size / Dimension | 0.138" L x 0.110" W (3.50mm x 2.80mm) | |
Height - Seated (Max) | 0.083" (2.10mm) | |
Lead Spacing | - | |
Manufacturer Size Code | B | |
Features | Derating Recommended; Fail Safe with Built-in Fuse | |
Lifetime @ Temp. | - | |
Standard Package | 2,000 | |
Weight | 0.001 KG | |
Application | Email for details | |
Replacement Part | TCFGB0J226M8R | |
Country of Origin | USA / JAPAN / Philippines / Malaysia | |
MOQ | 1 Piece | |
Picture / Image / Photo | Send via email |
TCFGB0J226M8R is in stock for immediate shipping now. We are the distributor of Rohm Semiconductor all series components. The condition of TCFGB0J226M8R is new and unused, you can buy TCFGB0J226M8R Rohm Semiconductor with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for TCFGB0J226M8R.
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