Manufacturer Part Number: | T350E685K025AT |
---|---|
Manufacturer: | Kemet |
Product Category: | Tantalum Capacitors |
Available Quantity: | 9258 Pieces |
Unit Price: | Quote by Email |
Description: | 6.8µF Conformal Coated Tantalum Capacitors 25V Radial 3.1 Ohm 0.217" Dia (5.50mm) |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
Production Status (Lifecycle): | In Production |
Delivery Time: | 1-2 Days |
Date Code (D/C): | New |
Datasheet Download: | T350E685K025AT Datasheet |
Internal Part Number | 898-T350E685K025AT | |
Manufacturer Lead time | 6-8 weeks | |
Condition | New & Unused, Original Sealed | |
Product Training Modules | Capacitor Basics- Typical Uses for Capacitors | |
EDA / CAD Models | Download from Accelerated Designs | |
Online Catalog | T35x - UltraDip II Series | |
Category | Capacitors | |
Family | Tantalum Capacitors | |
Manufacturer | Kemet | |
Series | T350 - UltraDip II | |
Packaging | Bulk | |
Part Status | Active | |
Capacitance | 6.8µF | |
Tolerance | ±10% | |
Voltage - Rated | 25V | |
ESR (Equivalent Series Resistance) | 3.1 Ohm | |
Type | Conformal Coated | |
Operating Temperature | -55°C ~ 125°C | |
Mounting Type | Through Hole | |
Package / Case | Radial | |
Size / Dimension | 0.217" Dia (5.50mm) | |
Height - Seated (Max) | 0.350" (8.90mm) | |
Lead Spacing | 0.100" (2.54mm) | |
Manufacturer Size Code | E | |
Features | General Purpose | |
Lifetime @ Temp. | - | |
Standard Package | 1,000 | |
Weight | 0.001 KG | |
Application | Email for details | |
Replacement Part | T350E685K025AT | |
Country of Origin | USA / JAPAN / Philippines / Malaysia | |
MOQ | 1 Piece | |
Picture / Image / Photo | Send via email |
T350E685K025AT is in stock for immediate shipping now. We are the distributor of Kemet all series components. The condition of T350E685K025AT is new and unused, you can buy T350E685K025AT Kemet with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for T350E685K025AT.
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