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| Manufacturer Part Number: | T322C106K020AS |
|---|---|
| Manufacturer: | Kemet |
| Product Category: | Tantalum Capacitors |
| Available Quantity: | 9080 Pieces |
| Unit Price: | Quote by Email |
| Description: | 10µF Molded Tantalum Capacitors 20V Axial 2.9 Ohm 0.180" Dia x 0.345" L (4.57mm x 8.76mm) |
| Lead Free Status / RoHS Status: | Contains lead / RoHS non-compliant |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Production Status (Lifecycle): | In Production |
| Delivery Time: | 1-2 Days |
| Date Code (D/C): | New |
| Datasheet Download: | T322C106K020AS Datasheet |
| Internal Part Number | 898-T322C106K020AS | |
| Manufacturer Lead time | 6-8 weeks | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | Capacitor Basics- Typical Uses for Capacitors | |
| Online Catalog | T322 Series | |
| Category | Capacitors | |
| Family | Tantalum Capacitors | |
| Manufacturer | Kemet | |
| Series | T322 | |
| Packaging | Bulk | |
| Part Status | Active | |
| Capacitance | 10µF | |
| Tolerance | ±10% | |
| Voltage - Rated | 20V | |
| ESR (Equivalent Series Resistance) | 2.9 Ohm | |
| Type | Molded | |
| Operating Temperature | -55°C ~ 125°C | |
| Mounting Type | Through Hole | |
| Package / Case | Axial | |
| Size / Dimension | 0.180" Dia x 0.345" L (4.57mm x 8.76mm) | |
| Height - Seated (Max) | - | |
| Lead Spacing | - | |
| Manufacturer Size Code | C | |
| Features | General Purpose | |
| Lifetime @ Temp. | - | |
| Standard Package | 100 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Replacement Part | T322C106K020AS | |
| Country of Origin | USA / JAPAN / Philippines / Malaysia | |
| MOQ | 1 Piece | |
| Picture / Image / Photo | Send via email | |
T322C106K020AS is in stock for immediate shipping now. We are the distributor of Kemet all series components. The condition of T322C106K020AS is new and unused, you can buy T322C106K020AS Kemet with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for T322C106K020AS.
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