Manufacturer Part Number: | SN74LVC2G38DCURE4 |
---|---|
Manufacturer: | Texas Instruments |
Product Category: | Logic - Gates and Inverters |
Available Quantity: | 9010 Pieces |
Unit Price: | Quote by Email |
Description: | NAND Gate IC 2 Channel Open Drain US8 |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
Production Status (Lifecycle): | Obsolete / Discontinued |
Delivery Time: | 1-2 Days |
Date Code (D/C): | New |
Datasheet Download: | SN74LVC2G38DCURE4 Datasheet |
Internal Part Number | 898-SN74LVC2G38DCURE4 | |
Manufacturer Lead time | 6-8 weeks | |
Condition | New & Unused, Original Sealed | |
EDA / CAD Models | Download from Accelerated Designs | |
Category | Integrated Circuits (ICs) | |
Family | Logic - Gates and Inverters | |
Manufacturer | Texas Instruments | |
Series | 74LVC | |
Packaging | Tape & Reel (TR) | |
Part Status | Obsolete | |
Logic Type | NAND Gate | |
Number of Circuits | 2 | |
Number of Inputs | 2 | |
Features | Open Drain | |
Voltage - Supply | 1.65 V ~ 5.5 V | |
Current - Quiescent (Max) | 10µA | |
Current - Output High, Low | -, 32mA | |
Logic Level - Low | 0.7 V ~ 0.8 V | |
Logic Level - High | 1.7 V ~ 2 V | |
Max Propagation Delay @ V, Max CL | 3.9ns @ 5V, 50pF | |
Operating Temperature | -40°C ~ 85°C | |
Mounting Type | Surface Mount | |
Supplier Device Package | US8 | |
Package / Case | 8-VFSOP (0.091", 2.30mm Width) | |
Standard Package | 3,000 | |
Weight | 0.001 KG | |
Application | Email for details | |
Replacement Part | SN74LVC2G38DCURE4 | |
Country of Origin | USA / JAPAN / Philippines / Malaysia | |
MOQ | 1 Piece | |
Picture / Image / Photo | Send via email |
SN74LVC2G38DCURE4 is in stock for immediate shipping now. We are the distributor of Texas Instruments all series components. The condition of SN74LVC2G38DCURE4 is new and unused, you can buy SN74LVC2G38DCURE4 Texas Instruments with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for SN74LVC2G38DCURE4.
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