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| Manufacturer Part Number: | S29GL256S90TFI023 |
|---|---|
| Manufacturer: | Cypress Semiconductor Corp |
| Product Category: | Memory |
| Available Quantity: | 9010 Pieces |
| Unit Price: | Quote by Email |
| Description: | IC FLASH 256MBIT 90NS 56TSOP |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Production Status (Lifecycle): | In Production |
| Delivery Time: | 1-2 Days |
| Date Code (D/C): | New |
| Datasheet Download: | S29GL256S90TFI023 Datasheet |
| Internal Part Number | 898-S29GL256S90TFI023 | |
| Manufacturer Lead time | 6-8 weeks | |
| Condition | New & Unused, Original Sealed | |
| Featured Product | Spansion® GL NOR Flash Memory | |
| PCN Design/Specification | Mold/Die Epoxy Alt 21/Oct/2015 Mold/Die Epoxy Addition 14/Dec/2015 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Manufacturer | Cypress Semiconductor Corp | |
| Series | GL-S | |
| Packaging | Tape & Reel (TR) | |
| Part Status | Active | |
| Format - Memory | FLASH | |
| Memory Type | FLASH - NOR | |
| Memory Size | 256M (16M x 16) | |
| Speed | 90ns | |
| Interface | Parallel | |
| Voltage - Supply | 2.7 V ~ 3.6 V | |
| Operating Temperature | -40°C ~ 85°C (TA) | |
| Package / Case | 56-TFSOP (0.724", 18.40mm Width) | |
| Supplier Device Package | 56-TSOP | |
| Standard Package | 1,000 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Replacement Part | S29GL256S90TFI023 | |
| Country of Origin | USA / JAPAN / Philippines / Malaysia | |
| MOQ | 1 Piece | |
| Picture / Image / Photo | Send via email | |
S29GL256S90TFI023 is in stock for immediate shipping now. We are the distributor of Cypress Semiconductor Corp all series components. The condition of S29GL256S90TFI023 is new and unused, you can buy S29GL256S90TFI023 Cypress Semiconductor Corp with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for S29GL256S90TFI023.
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