Stocking distributor of Electronic Components
Email: [email protected]
| Manufacturer Part Number: | RG2012P-2260-B-T1 |
|---|---|
| Manufacturer: | Susumu |
| Product Category: | Chip Resistor - Surface Mount |
| Available Quantity: | 9010 Pieces |
| Unit Price: | Quote by Email |
| Description: | RES SMD 226 OHM 0.1% 1/8W 0805 |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Production Status (Lifecycle): | Obsolete / Discontinued |
| Delivery Time: | 1-2 Days |
| Date Code (D/C): | New |
| Datasheet Download: | RG2012P-2260-B-T1 Datasheet |
| Internal Part Number | 898-RG2012P-2260-B-T1 | |
| Manufacturer Lead time | 6-8 weeks | |
| Condition | New & Unused, Original Sealed | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Category | Resistors | |
| Family | Chip Resistor - Surface Mount | |
| Manufacturer | Susumu | |
| Series | RG | |
| Packaging | Tape & Reel (TR) | |
| Part Status | Obsolete | |
| Resistance (Ohms) | 226 | |
| Tolerance | ±0.1% | |
| Power (Watts) | 0.125W, 1/8W | |
| Composition | Thin Film | |
| Features | Automotive AEC-Q200 | |
| Temperature Coefficient | ±25ppm/°C | |
| Operating Temperature | -55°C ~ 155°C | |
| Package / Case | 0805 (2012 Metric) | |
| Supplier Device Package | 0805 | |
| Size / Dimension | 0.079" L x 0.049" W (2.00mm x 1.25mm) | |
| Height | 0.020" (0.50mm) | |
| Number of Terminations | 2 | |
| Standard Package | 1,000 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Replacement Part | RG2012P-2260-B-T1 | |
| Country of Origin | USA / JAPAN / Philippines / Malaysia | |
| MOQ | 1 Piece | |
| Picture / Image / Photo | Send via email | |
RG2012P-2260-B-T1 is in stock for immediate shipping now. We are the distributor of Susumu all series components. The condition of RG2012P-2260-B-T1 is new and unused, you can buy RG2012P-2260-B-T1 Susumu with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for RG2012P-2260-B-T1.
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