Manufacturer Part Number: | RC1608F3321CS |
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Manufacturer: | Samsung Electro-Mechanics America, Inc. |
Product Category: | Chip Resistor - Surface Mount |
Available Quantity: | 22959 Pieces |
Unit Price: | Quote by Email |
Description: | RES SMD 3.32K OHM 1% 1/10W 0603 |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
Production Status (Lifecycle): | In Production |
Delivery Time: | 1-2 Days |
Date Code (D/C): | New |
Datasheet Download: | RC1608F3321CS Datasheet |
Internal Part Number | 898-RC1608F3321CS | |
Manufacturer Lead time | 6-8 weeks | |
Condition | New & Unused, Original Sealed | |
RoHS Information | Chip Resistor RoHS 2 Compliance | |
Featured Product | Chip Resistors and Arrays | |
Online Catalog | RC1608 Series | |
Category | Resistors | |
Family | Chip Resistor - Surface Mount | |
Manufacturer | Samsung Electro-Mechanics America, Inc. | |
Series | RC | |
Packaging | Cut Tape (CT) | |
Part Status | Active | |
Resistance (Ohms) | 3.32k | |
Tolerance | ±1% | |
Power (Watts) | 0.1W, 1/10W | |
Composition | Thick Film | |
Features | Moisture Resistant | |
Temperature Coefficient | ±100ppm/°C | |
Operating Temperature | -55°C ~ 155°C | |
Package / Case | 0603 (1608 Metric) | |
Supplier Device Package | 0603 | |
Size / Dimension | 0.063" L x 0.031" W (1.60mm x 0.80mm) | |
Height | 0.022" (0.55mm) | |
Number of Terminations | 2 | |
Standard Package | 1 | |
Weight | 0.001 KG | |
Application | Email for details | |
Replacement Part | RC1608F3321CS | |
Country of Origin | USA / JAPAN / Philippines / Malaysia | |
MOQ | 1 Piece | |
Picture / Image / Photo | Send via email |
RC1608F3321CS is in stock for immediate shipping now. We are the distributor of Samsung Electro-Mechanics America, Inc. all series components. The condition of RC1608F3321CS is new and unused, you can buy RC1608F3321CS Samsung Electro-Mechanics America, Inc. with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for RC1608F3321CS.
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