Manufacturer Part Number: | RC0402J561CS |
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Manufacturer: | Samsung Electro-Mechanics America, Inc. |
Product Category: | Chip Resistor - Surface Mount |
Available Quantity: | 29010 Pieces |
Unit Price: | Quote by Email |
Description: | RES SMD 560 OHM 5% 1/32W 01005 |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
Production Status (Lifecycle): | In Production |
Delivery Time: | 1-2 Days |
Date Code (D/C): | New |
Datasheet Download: | RC0402J561CS Datasheet |
Internal Part Number | 898-RC0402J561CS | |
Manufacturer Lead time | 6-8 weeks | |
Condition | New & Unused, Original Sealed | |
RoHS Information | Chip Resistor RoHS 2 Compliance | |
Featured Product | Chip Resistors and Arrays | |
Online Catalog | RC0402 Series | |
Category | Resistors | |
Family | Chip Resistor - Surface Mount | |
Manufacturer | Samsung Electro-Mechanics America, Inc. | |
Series | RC | |
Packaging | Tape & Reel (TR) | |
Part Status | Active | |
Resistance (Ohms) | 560 | |
Tolerance | ±5% | |
Power (Watts) | 0.03W, 1/32W | |
Composition | Thick Film | |
Features | Moisture Resistant | |
Temperature Coefficient | ±250ppm/°C | |
Operating Temperature | -55°C ~ 125°C | |
Package / Case | 01005 (0402 Metric) | |
Supplier Device Package | 01005 | |
Size / Dimension | 0.016" L x 0.008" W (0.40mm x 0.20mm) | |
Height | 0.006" (0.15mm) | |
Number of Terminations | 2 | |
Standard Package | 20,000 | |
Weight | 0.001 KG | |
Application | Email for details | |
Replacement Part | RC0402J561CS | |
Country of Origin | USA / JAPAN / Philippines / Malaysia | |
MOQ | 1 Piece | |
Picture / Image / Photo | Send via email |
RC0402J561CS is in stock for immediate shipping now. We are the distributor of Samsung Electro-Mechanics America, Inc. all series components. The condition of RC0402J561CS is new and unused, you can buy RC0402J561CS Samsung Electro-Mechanics America, Inc. with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for RC0402J561CS.
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