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PIC32MX230F256B-I/SP

PIC32MX230F256B-I/SP
Manufacturer Part Number:PIC32MX230F256B-I/SP
Manufacturer:
Product Category:Embedded - Microcontrollers
Available Quantity:9014 Pieces
Unit Price:Quote by Email
Description:MIPS32® M4K™ PIC® 32MX Microcontroller IC 32-Bit 40MHz 256KB (256K x 8) FLASH 28-SPDIP
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL):1 (Unlimited)
Production Status (Lifecycle):In Production
Delivery Time:1-2 Days
Date Code (D/C):New
Datasheet Download: PIC32MX230F256B-I/SP Datasheet
PIC32MX230F256B-I/SP´s Parameters
Internal Part Number898-PIC32MX230F256B-I/SP
Manufacturer Lead time6-8 weeks
ConditionNew & Unused, Original Sealed
Design ResourcesDevelopment Tool Selector
PCN Design/SpecificationDatasheet Update 31/Jul/2015
Errata/Datasheet Update 31/Jul/2015
New DeviceDoc 12/Apr/2016
PCN PackagingLabel and Packing Changes 23/Sep/2015
Online Catalog PIC® 32MX
CategoryIntegrated Circuits (ICs)
FamilyEmbedded - Microcontrollers
ManufacturerMicrochip Technology
SeriesPIC® 32MX
PackagingTube
Part StatusActive
Core ProcessorMIPS32® M4K™
Core Size32-Bit
Speed40MHz
ConnectivityI²C, IrDA, LIN, PMP, SPI, UART/USART, USB OTG
PeripheralsBrown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O21
Program Memory Size256KB (256K x 8)
Program Memory TypeFLASH
EEPROM Size-
RAM Size16K x 8
Voltage - Supply (Vcc/Vdd)2.3 V ~ 3.6 V
Data ConvertersA/D 10x10b
Oscillator TypeInternal
Operating Temperature-40°C ~ 85°C (TA)
Package / Case28-DIP (0.300", 7.62mm)
Supplier Device Package28-SPDIP
Standard Package 15
Weight0.001 KG
ApplicationEmail for details
Replacement PartPIC32MX230F256B-I/SP
Country of OriginUSA / JAPAN / Philippines / Malaysia
MOQ1 Piece
Picture / Image / PhotoSend via email

PIC32MX230F256B-I/SP is in stock for immediate shipping now. We are the distributor of Microchip Technology all series components. The condition of PIC32MX230F256B-I/SP is new and unused, you can buy PIC32MX230F256B-I/SP Microchip Technology with us at a very low price and quick delivery.

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