| Manufacturer Part Number: | PIC24FJ32GB002-I/SP |
|---|---|
| Manufacturer: | Microchip Technology |
| Product Category: | Embedded - Microcontrollers |
| Available Quantity: | 9252 Pieces |
| Unit Price: | Quote by Email |
| Description: | PIC PIC® XLP™ 24F Microcontroller IC 16-Bit 32MHz 32KB (11K x 24) FLASH 28-SPDIP |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Production Status (Lifecycle): | In Production |
| Delivery Time: | 1-2 Days |
| Date Code (D/C): | New |
| Datasheet Download: | PIC24FJ32GB002-I/SP Datasheet |
| Internal Part Number | 898-PIC24FJ32GB002-I/SP | |
| Manufacturer Lead time | 6-8 weeks | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | XLP Deep Sleep Mode Getting the Lowest Current Consumption from a PIC24F MCU Bluetooth Audio Development Platform | |
| Design Resources | Development Tool Selector | |
| Featured Product | PIC24FJ/33FJ MCUs & dsPIC® DSCs | |
| PCN Assembly/Origin | Qualification Revision 23/Aug/2013 Qualification SPDIP-28L, PDIP-8/16L 18/Sep/2013 Additional Fabrication Site 11/Oct/2013 Qualification Revision 18/Dec/2013 Qualification SPDIP-28 Package 26/Dec/2013 Qualification Revision 06/Feb/2014 Qualification Copper Wire 26/Mar/2014 | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| Online Catalog | PIC® XLP™ 24F | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Manufacturer | Microchip Technology | |
| Series | PIC® XLP™ 24F | |
| Packaging | Tube | |
| Part Status | Active | |
| Core Processor | PIC | |
| Core Size | 16-Bit | |
| Speed | 32MHz | |
| Connectivity | I²C, IrDA, SPI, UART/USART, USB OTG | |
| Peripherals | Brown-out Detect/Reset, LVD, POR, PWM, WDT | |
| Number of I/O | 19 | |
| Program Memory Size | 32KB (11K x 24) | |
| Program Memory Type | FLASH | |
| EEPROM Size | - | |
| RAM Size | 8K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 2 V ~ 3.6 V | |
| Data Converters | A/D 9x10b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 85°C (TA) | |
| Package / Case | 28-DIP (0.300", 7.62mm) | |
| Supplier Device Package | 28-SPDIP | |
| Standard Package | 15 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Replacement Part | PIC24FJ32GB002-I/SP | |
| Country of Origin | USA / JAPAN / Philippines / Malaysia | |
| MOQ | 1 Piece | |
| Picture / Image / Photo | Send via email | |
PIC24FJ32GB002-I/SP is in stock for immediate shipping now. We are the distributor of Microchip Technology all series components. The condition of PIC24FJ32GB002-I/SP is new and unused, you can buy PIC24FJ32GB002-I/SP Microchip Technology with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for PIC24FJ32GB002-I/SP.
| GRM0336T1E910JD01D | 91pF 25V Ceramic Capacitor T2H 0201 (0603 Metric) 0.024" L x 0.012" W (0.60mm x 0.30mm) | GRM0336T1E910JD01D.pdf | |
| 3120-F551-P7T1-W15FY3-16A | CIR BRKR THRM 16A 250VAC 50VDC | 3120-F551-P7T1-W15FY3-16A.pdf | |
| 170M4215 | FUSE SQ 550A 700VAC RECTANGULAR | 170M4215.pdf | |
| IRF7458PBF | MOSFET N-CH 30V 14A 8-SOIC | IRF7458PBF.pdf | |
| HM79-40181LFTR13 | 180µH Unshielded Wirewound Inductor 510mA 710 mOhm Max Nonstandard | HM79-40181LFTR13.pdf | |
| 9250-181 | 180nH Shielded Wirewound Inductor 1.3A 47 mOhm Max Axial | 9250-181.pdf | |
| TLV2775IPWR | General Purpose Amplifier 4 Circuit Rail-to-Rail 16-TSSOP | TLV2775IPWR.pdf | |
| 74HC123BQ,115 | Monostable Multivibrator 65ns 16-DHVQFN (2.5x3.5) | 74HC123BQ,115.pdf | |
| XPLAWT-00-0000-000BV5051 | LED Lighting XLamp® XP-L White, Cool 6200K 2.95V 1.05A 125° 2-SMD, No Lead, Exposed Pad | XPLAWT-00-0000-000BV5051.pdf | |
| AGQ260A12 | Telecom Relay DPDT (2 Form C) Surface Mount | AGQ260A12.pdf | |
| BACC63BV14B12SN | 12 Position Circular Connector Receptacle, Female Sockets Crimp Gold | BACC63BV14B12SN.pdf | |
| CRCW060384R5FKEB | RES SMD 84.5 OHM 1% 1/10W 0603 | CRCW060384R5FKEB.pdf | |
| RSF1JB2K70 | RES MO 1W 2.7K OHM 5% AXIAL | RSF1JB2K70.pdf |