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PIC24F08KL201-E/P

PIC24F08KL201-E/P
Manufacturer Part Number:PIC24F08KL201-E/P
Manufacturer:
Product Category:Embedded - Microcontrollers
Available Quantity:9010 Pieces
Unit Price:Quote by Email
Description:PIC PIC® XLP™ 24F Microcontroller IC 16-Bit 32MHz 8KB (2.75K x 24) FLASH 20-PDIP
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL):1 (Unlimited)
Production Status (Lifecycle):In Production
Delivery Time:1-2 Days
Date Code (D/C):New
Datasheet Download: PIC24F08KL201-E/P Datasheet
PIC24F08KL201-E/P´s Parameters
Internal Part Number898-PIC24F08KL201-E/P
Manufacturer Lead time6-8 weeks
ConditionNew & Unused, Original Sealed
Product Training ModulesBluetooth Audio Development Platform
Design ResourcesDevelopment Tool Selector
PCN Design/SpecificationPIC24F16KL402 Datasheet Revision 12/Nov/2013
PIC24F16KL402 Errata Update 17/Mar/2014
Copper Bond Wire 07/Apr/2015
PCN PackagingLabel and Packing Changes 23/Sep/2015
CategoryIntegrated Circuits (ICs)
FamilyEmbedded - Microcontrollers
ManufacturerMicrochip Technology
SeriesPIC® XLP™ 24F
PackagingTube
Part StatusActive
Core ProcessorPIC
Core Size16-Bit
Speed32MHz
ConnectivityI²C, IrDA, LIN, SPI, UART/USART
PeripheralsBrown-out Detect/Reset, HLVD, POR, PWM, WDT
Number of I/O17
Program Memory Size8KB (2.75K x 24)
Program Memory TypeFLASH
EEPROM Size-
RAM Size512 x 8
Voltage - Supply (Vcc/Vdd)1.8 V ~ 3.6 V
Data ConvertersA/D 12x10b
Oscillator TypeInternal
Operating Temperature-40°C ~ 125°C (TA)
Package / Case20-DIP (0.300", 7.62mm)
Supplier Device Package20-PDIP
Standard Package 22
Weight0.001 KG
ApplicationEmail for details
Replacement PartPIC24F08KL201-E/P
Country of OriginUSA / JAPAN / Philippines / Malaysia
MOQ1 Piece
Picture / Image / PhotoSend via email

PIC24F08KL201-E/P is in stock for immediate shipping now. We are the distributor of Microchip Technology all series components. The condition of PIC24F08KL201-E/P is new and unused, you can buy PIC24F08KL201-E/P Microchip Technology with us at a very low price and quick delivery.

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