Manufacturer Part Number: | MPC860TZQ66D4 |
---|---|
Manufacturer: | NXP Semiconductors |
Product Category: | Embedded - Microprocessors |
Available Quantity: | 9010 Pieces |
Unit Price: | Quote by Email |
Description: | MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 357-PBGA (25x25) |
Lead Free Status / RoHS Status: | Contains lead / RoHS non-compliant |
Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
Production Status (Lifecycle): | In Production |
Delivery Time: | 1-2 Days |
Date Code (D/C): | New |
Datasheet Download: | MPC860TZQ66D4 Datasheet |
Internal Part Number | 898-MPC860TZQ66D4 | |
Manufacturer Lead time | 6-8 weeks | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | Copper Wire Bond Update 01/Aug/2014 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - Microprocessors | |
Manufacturer | Freescale Semiconductor - NXP | |
Series | MPC8xx | |
Packaging | Tray | |
Part Status | Active | |
Core Processor | MPC8xx | |
Number of Cores/Bus Width | 1 Core, 32-Bit | |
Speed | 66MHz | |
Co-Processors/DSP | Communications; CPM | |
RAM Controllers | DRAM | |
Graphics Acceleration | No | |
Display & Interface Controllers | - | |
Ethernet | 10 Mbps (4), 10/100 Mbps (1) | |
SATA | - | |
USB | - | |
Voltage - I/O | 3.3V | |
Operating Temperature | 0°C ~ 95°C (TA) | |
Security Features | - | |
Package / Case | 357-BBGA | |
Supplier Device Package | 357-PBGA (25x25) | |
Additional Interfaces | HDLC/SDLC, I²C, IrDA, PCMCIA, SPI, TDM, UART/USART | |
Standard Package | 44 | |
Weight | 0.001 KG | |
Application | Email for details | |
Replacement Part | MPC860TZQ66D4 | |
Country of Origin | USA / JAPAN / Philippines / Malaysia | |
MOQ | 1 Piece | |
Picture / Image / Photo | Send via email |
MPC860TZQ66D4 is in stock for immediate shipping now. We are the distributor of NXP Semiconductors all series components. The condition of MPC860TZQ66D4 is new and unused, you can buy MPC860TZQ66D4 NXP Semiconductors with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for MPC860TZQ66D4.
GCM2165C2A222JA16D | 2200pF 100V Ceramic Capacitor C0G, NP0 0805 (2012 Metric) 0.079" L x 0.049" W (2.00mm x 1.25mm) | GCM2165C2A222JA16D.pdf | |
NL111X | 6.35mm (0.250", 1/4") - Headphone Phone Jack Mono Connector Solder Eyelet(s) | NL111X.pdf | |
445I33E24M00000 | 24MHz ±30ppm Crystal 20pF 40 Ohm -40°C ~ 85°C Surface Mount 2-SMD | 445I33E24M00000.pdf | |
8N3QV01KG-0036CDI | VCXO IC 100MHz, 125MHz, 250MHz, 312.5MHz 10-CLCC | 8N3QV01KG-0036CDI.pdf | |
MPC8313ZQAFFB | PowerPC e300c3 Microprocessor IC MPC83xx 1 Core, 32-Bit 333MHz 516-TEPBGA (27x27) | MPC8313ZQAFFB.pdf | |
IS46TR16640A-125JBLA2-TR | IC DDR3 1GB 96BGA | IS46TR16640A-125JBLA2-TR.pdf | |
L152-5770502400000 | LED Lighting LUXEON 5258 White, Cool 5700K 24V 160mA 115° 4-SMD, No Lead Exposed Pad | L152-5770502400000.pdf | |
5680702837F | LED CBI 3MM QUAD LEVEL | 5680702837F.pdf | |
DB02D2412A | DCDC CONVERTER +/-12VOUT 2W | DB02D2412A.pdf | |
DBMC9C4SJA197 | COMBO 9W4 F PCB R/A 75O G TIN | DBMC9C4SJA197.pdf | |
SIP110-PPVC-D14-ST-BK | 28 Position Ribbon Cable, DIP Header Connector Black IDC 28 AWG Through Hole | SIP110-PPVC-D14-ST-BK.pdf | |
MCU08050D8660BP100 | RES SMD 866 OHM 0.1% 1/8W 0805 | MCU08050D8660BP100.pdf |