Manufacturer Part Number: | MPC860DEZQ66D4 |
---|---|
Manufacturer: | NXP Semiconductors |
Product Category: | Embedded - Microprocessors |
Available Quantity: | 9010 Pieces |
Unit Price: | Quote by Email |
Description: | MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 357-PBGA (25x25) |
Lead Free Status / RoHS Status: | Contains lead / RoHS non-compliant |
Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
Production Status (Lifecycle): | In Production |
Delivery Time: | 1-2 Days |
Date Code (D/C): | New |
Datasheet Download: | MPC860DEZQ66D4 Datasheet |
Internal Part Number | 898-MPC860DEZQ66D4 | |
Manufacturer Lead time | 6-8 weeks | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | Copper Wire Bond Update 01/Aug/2014 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - Microprocessors | |
Manufacturer | Freescale Semiconductor - NXP | |
Series | MPC8xx | |
Packaging | Tray | |
Part Status | Active | |
Core Processor | MPC8xx | |
Number of Cores/Bus Width | 1 Core, 32-Bit | |
Speed | 66MHz | |
Co-Processors/DSP | Communications; CPM | |
RAM Controllers | DRAM | |
Graphics Acceleration | No | |
Display & Interface Controllers | - | |
Ethernet | 10 Mbps (2) | |
SATA | - | |
USB | - | |
Voltage - I/O | 3.3V | |
Operating Temperature | 0°C ~ 95°C (TA) | |
Security Features | - | |
Package / Case | 357-BBGA | |
Supplier Device Package | 357-PBGA (25x25) | |
Additional Interfaces | I²C, IrDA, PCMCIA, SPI, TDM, UART/USART | |
Standard Package | 44 | |
Weight | 0.001 KG | |
Application | Email for details | |
Replacement Part | MPC860DEZQ66D4 | |
Country of Origin | USA / JAPAN / Philippines / Malaysia | |
MOQ | 1 Piece | |
Picture / Image / Photo | Send via email |
MPC860DEZQ66D4 is in stock for immediate shipping now. We are the distributor of NXP Semiconductors all series components. The condition of MPC860DEZQ66D4 is new and unused, you can buy MPC860DEZQ66D4 NXP Semiconductors with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for MPC860DEZQ66D4.
UVP1J3R3MDD1TA | 3.3µF 63V Aluminum Capacitors Radial, Can 2000 Hrs @ 85°C | UVP1J3R3MDD1TA.pdf | |
VJ0805D240FLXAJ | 24pF 25V Ceramic Capacitor C0G, NP0 0805 (2012 Metric) 0.079" L x 0.049" W (2.00mm x 1.25mm) | VJ0805D240FLXAJ.pdf | |
SQCAEM1R6BATME\500 | 1.6pF 150V Ceramic Capacitor M 0605 (1613 Metric) 0.055" L x 0.055" W (1.40mm x 1.40mm) | SQCAEM1R6BATME\500.pdf | |
DSC1123AI2-250.0000T | 250MHz LVDS MEMS (Silicon) Oscillator Surface Mount 2.25 V ~ 3.6 V 32mA Enable/Disable | DSC1123AI2-250.0000T.pdf | |
PE-0201CC2N4STT | 2.4nH Unshielded Multilayer Inductor 350mA 200 mOhm Max 0201 (0603 Metric) | PE-0201CC2N4STT.pdf | |
PIC32MX530F128L-I/PT | MIPS32® M4K™ PIC® 32MX Microcontroller IC 32-Bit 40MHz 128KB (128K x 8) FLASH 100-TQFP (12x12) | PIC32MX530F128L-I/PT.pdf | |
S-8353A33UA-IQST2G | Boost Switching Regulator IC Positive Fixed 3.3V 1 Output 300mA (Switch) TO-243AA | S-8353A33UA-IQST2G.pdf | |
OPIA2210DTUE | Optoisolator Transistor with Base Output 5000Vrms 1 Channel 6-DIP | OPIA2210DTUE.pdf | |
LTE-3371T | Infrared (IR) Emitter 940nm 1.25V 100mA 6.77mW/sr @ 20mA 40° Radial | LTE-3371T.pdf | |
PK25-D5-S15 | CONVERTER DC/DC 15V OUT 21W | PK25-D5-S15.pdf | |
RER65F2550MCSL | RES CHAS MNT 255 OHM 1% 10W | RER65F2550MCSL.pdf | |
146853-1 | 25000, Cuttable Positions Header, Unshrouded, Breakaway Connector 0.100" (2.54mm) Through Hole Tin-Lead | 146853-1.pdf | |
929835-01-20 | 20 Positions Header, Unshrouded, Breakaway Connector 0.100" (2.54mm) Through Hole, Right Angle Tin-Lead | 929835-01-20.pdf | |
RCP2512W82R0GEB | RES SMD 82 OHM 2% 22W 2512 | RCP2512W82R0GEB.pdf |