Manufacturer Part Number: | MPC860DEVR66D4 |
---|---|
Manufacturer: | NXP Semiconductors |
Product Category: | Embedded - Microprocessors |
Available Quantity: | 9010 Pieces |
Unit Price: | Quote by Email |
Description: | MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 357-PBGA (25x25) |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
Production Status (Lifecycle): | In Production |
Delivery Time: | 1-2 Days |
Date Code (D/C): | New |
Datasheet Download: | MPC860DEVR66D4 Datasheet |
Internal Part Number | 898-MPC860DEVR66D4 | |
Manufacturer Lead time | 6-8 weeks | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | Copper Wire Bond Update 01/Aug/2014 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - Microprocessors | |
Manufacturer | Freescale Semiconductor - NXP | |
Series | MPC8xx | |
Packaging | Tray | |
Part Status | Active | |
Core Processor | MPC8xx | |
Number of Cores/Bus Width | 1 Core, 32-Bit | |
Speed | 66MHz | |
Co-Processors/DSP | Communications; CPM | |
RAM Controllers | DRAM | |
Graphics Acceleration | No | |
Display & Interface Controllers | - | |
Ethernet | 10 Mbps (2) | |
SATA | - | |
USB | - | |
Voltage - I/O | 3.3V | |
Operating Temperature | 0°C ~ 95°C (TA) | |
Security Features | - | |
Package / Case | 357-BBGA | |
Supplier Device Package | 357-PBGA (25x25) | |
Additional Interfaces | I²C, IrDA, PCMCIA, SPI, TDM, UART/USART | |
Standard Package | 220 | |
Weight | 0.001 KG | |
Application | Email for details | |
Replacement Part | MPC860DEVR66D4 | |
Country of Origin | USA / JAPAN / Philippines / Malaysia | |
MOQ | 1 Piece | |
Picture / Image / Photo | Send via email |
MPC860DEVR66D4 is in stock for immediate shipping now. We are the distributor of NXP Semiconductors all series components. The condition of MPC860DEVR66D4 is new and unused, you can buy MPC860DEVR66D4 NXP Semiconductors with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for MPC860DEVR66D4.
GRM1555C2A330JA01D | 33pF 100V Ceramic Capacitor C0G, NP0 0402 (1005 Metric) 0.039" L x 0.020" W (1.00mm x 0.50mm) | GRM1555C2A330JA01D.pdf | |
GRM0335C1E470GA01J | 47pF 25V Ceramic Capacitor C0G, NP0 0201 (0603 Metric) 0.024" L x 0.012" W (0.60mm x 0.30mm) | GRM0335C1E470GA01J.pdf | |
MKP385462016JF02W0 | 0.62µF Film Capacitor 110V 160V Polypropylene (PP), Metallized Radial 0.689" L x 0.276" W (17.50mm x 7.00mm) | MKP385462016JF02W0.pdf | |
IMG1-1RLS5-30476-7.5-V | CIR BRKR MAG-HYDR LEVER | IMG1-1RLS5-30476-7.5-V.pdf | |
MLG1608S1R0JT000 | 1µH Unshielded Multilayer Inductor 70mA 5.5 Ohm Max 0603 (1608 Metric) | MLG1608S1R0JT000.pdf | |
8N4SV76KC-0141CDI8 | VCXO IC 156.25MHz 6-CLCC | 8N4SV76KC-0141CDI8.pdf | |
AT27BV512-12TI | IC OTP 512KBIT 120NS 28TSOP | AT27BV512-12TI.pdf | |
HHD25ZED-N | CONV DC-DC 85W 3.3/2.5V DUAL | HHD25ZED-N.pdf | |
5178238-4 | 26 Position Receptacle Connector Panel Mount, Through Hole, Right Angle Solder | 5178238-4.pdf | |
MDM-37SSM5 | 37 Position D-Type, Micro-D Receptacle, Female Sockets Connector, Panel Mount Solder Cup | MDM-37SSM5.pdf | |
178-025-513R481 | 25, 25 Position D-Sub - Stacked Receptacle, Female Sockets Connector, Board Edge, Through Hole, Right Angle Solder | 178-025-513R481.pdf | |
SFW27R-2STE1 | 27 Position FFC, FPC Connector Contacts, Top 0.039" (1.00mm) Surface Mount, Right Angle | SFW27R-2STE1.pdf | |
P08-100HL-E-G | 100 Position Connector Self Mating, Non-Gendered Surface Mount Gold | P08-100HL-E-G.pdf | |
6-917570-4 | 4 Position Header Connector 0.059" (1.50mm) Surface Mount, Right Angle Gold | 6-917570-4.pdf |