Stocking distributor of Electronic Components
Email: [email protected]
| Manufacturer Part Number: | MIS-019-01-F-D |
|---|---|
| Manufacturer: | Samtec Inc. |
| Product Category: | Rectangular - Board to Board Connectors - Arrays, Edge Type, Mezzanine |
| Available Quantity: | 9010 Pieces |
| Unit Price: | Quote by Email |
| Description: | 38 Position Connector Socket, Center Strip Contacts Surface Mount Gold |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Production Status (Lifecycle): | In Production |
| Delivery Time: | 1-2 Days |
| Date Code (D/C): | New |
| Datasheet Download: | MIS-019-01-F-D Datasheet |
| Internal Part Number | 898-MIS-019-01-F-D | |
| Manufacturer Lead time | 6-8 weeks | |
| Condition | New & Unused, Original Sealed | |
| Category | Connectors, Interconnects | |
| Family | Rectangular - Board to Board Connectors - Arrays, Edge Type, Mezzanine | |
| Manufacturer | Samtec Inc. | |
| Series | Q Strip® MIS | |
| Packaging | Tray | |
| Part Status | Active | |
| Connector Type | Socket, Center Strip Contacts | |
| Number of Positions | 38 | |
| Pitch | 0.025" (0.64mm) | |
| Number of Rows | 2 | |
| Mounting Type | Surface Mount | |
| Features | Board Guide, Ground Bus (Plane) | |
| Contact Finish | Gold | |
| Contact Finish Thickness | Flash | |
| Mated Stacking Heights | 11mm, 16mm, 18.75mm, 22mm | |
| Height Above Board | 0.143" (3.63mm) | |
| Standard Package | 1 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Replacement Part | MIS-019-01-F-D | |
| Country of Origin | USA / JAPAN / Philippines / Malaysia | |
| MOQ | 1 Piece | |
| Picture / Image / Photo | Send via email | |
MIS-019-01-F-D is in stock for immediate shipping now. We are the distributor of Samtec Inc. all series components. The condition of MIS-019-01-F-D is new and unused, you can buy MIS-019-01-F-D Samtec Inc. with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for MIS-019-01-F-D.
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