Manufacturer Part Number: | MEC1-160-02-F-D-EM2 |
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Manufacturer: | Samtec Inc. |
Product Category: | Card Edge Connectors - Edgeboard Connectors |
Available Quantity: | 9010 Pieces |
Unit Price: | Quote by Email |
Description: | CONN EDGE CARD DL 120POS SMD |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
Production Status (Lifecycle): | In Production |
Delivery Time: | 1-2 Days |
Date Code (D/C): | New |
Datasheet Download: | MEC1-160-02-F-D-EM2 Datasheet |
Internal Part Number | 898-MEC1-160-02-F-D-EM2 | |
Manufacturer Lead time | 6-8 weeks | |
Condition | New & Unused, Original Sealed | |
Category | Connectors, Interconnects | |
Family | Card Edge Connectors - Edgeboard Connectors | |
Manufacturer | Samtec Inc. | |
Series | MEC1 | |
Packaging | Tube | |
Part Status | Active | |
Card Type | Non Specified - Dual Edge | |
Gender | Female | |
Number of Positions/Bay/Row | - | |
Number of Positions | 120 | |
Card Thickness | 0.062" (1.57mm) | |
Number of Rows | 2 | |
Pitch | 0.039" (1.00mm) | |
Features | - | |
Mounting Type | Surface Mount | |
Termination | Solder | |
Contact Material | Phosphor Bronze | |
Contact Finish | Gold | |
Contact Finish Thickness | 3µin (0.08µm) | |
Contact Type | Loop Bellows | |
Color | Black | |
Flange Feature | - | |
Operating Temperature | -55°C ~ 125°C | |
Material - Insulation | Liquid Crystal Polymer (LCP) | |
Read Out | Dual | |
Standard Package | 1 | |
Weight | 0.001 KG | |
Application | Email for details | |
Replacement Part | MEC1-160-02-F-D-EM2 | |
Country of Origin | USA / JAPAN / Philippines / Malaysia | |
MOQ | 1 Piece | |
Picture / Image / Photo | Send via email |
MEC1-160-02-F-D-EM2 is in stock for immediate shipping now. We are the distributor of Samtec Inc. all series components. The condition of MEC1-160-02-F-D-EM2 is new and unused, you can buy MEC1-160-02-F-D-EM2 Samtec Inc. with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for MEC1-160-02-F-D-EM2.
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