| Manufacturer Part Number: | MCP607-I/SN |
|---|---|
| Manufacturer: | Microchip Technology |
| Product Category: | Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps |
| Available Quantity: | 11680 Pieces |
| Unit Price: | Quote by Email |
| Description: | General Purpose Amplifier 2 Circuit Rail-to-Rail 8-SOIC |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Production Status (Lifecycle): | In Production |
| Delivery Time: | 1-2 Days |
| Date Code (D/C): | New |
| Datasheet Download: | MCP607-I/SN Datasheet |
| Internal Part Number | 898-MCP607-I/SN | |
| Manufacturer Lead time | 6-8 weeks | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | SOIC-8L Copper Bond Wire 18/Sep/2013 SOIC-8L Copper Bond Wire 18/Dec/2013 | |
| PCN Assembly/Origin | SOIC-8L Copper Bond Wire Revision 06/Feb/2014 Assembly Site Addition 08/Apr/2015 Assembly Site Addition 08/Apr/2015 | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Online Catalog | General Purpose | |
| Category | Integrated Circuits (ICs) | |
| Family | Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps | |
| Manufacturer | Microchip Technology | |
| Series | - | |
| Packaging | Tube | |
| Part Status | Active | |
| Amplifier Type | General Purpose | |
| Number of Circuits | 2 | |
| Output Type | Rail-to-Rail | |
| Slew Rate | 0.08 V/µs | |
| Gain Bandwidth Product | 155kHz | |
| -3db Bandwidth | - | |
| Current - Input Bias | 1pA | |
| Voltage - Input Offset | 250µV | |
| Current - Supply | 18.7µA | |
| Current - Output / Channel | 17mA | |
| Voltage - Supply, Single/Dual (±) | 2.5 V ~ 6 V | |
| Operating Temperature | -40°C ~ 85°C | |
| Mounting Type | Surface Mount | |
| Package / Case | 8-SOIC (0.154", 3.90mm Width) | |
| Supplier Device Package | 8-SOIC | |
| Standard Package | 100 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Replacement Part | MCP607-I/SN | |
| Country of Origin | USA / JAPAN / Philippines / Malaysia | |
| MOQ | 1 Piece | |
| Picture / Image / Photo | Send via email | |
MCP607-I/SN is in stock for immediate shipping now. We are the distributor of Microchip Technology all series components. The condition of MCP607-I/SN is new and unused, you can buy MCP607-I/SN Microchip Technology with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for MCP607-I/SN.
| SLP182M200H7P3 | 1800µF 200V Aluminum Capacitors Radial, Can - Snap-In 111 mOhm 3000 Hrs @ 105°C | SLP182M200H7P3.pdf | |
| VJ0603D7R5DLPAP | 7.5pF 250V Ceramic Capacitor C0G, NP0 0603 (1608 Metric) 0.063" L x 0.031" W (1.60mm x 0.80mm) | VJ0603D7R5DLPAP.pdf | |
| W91-X152-10 | CIR BRKR MAG-HYDR 10A 65VDC | W91-X152-10.pdf | |
| GCM18DCMS | CONN EDGECARD 36POS .156 WW | GCM18DCMS.pdf | |
| A3P250-2PQ208I | IC FPGA 151 I/O 208QFP | A3P250-2PQ208I.pdf | |
| LIF-UC120-SWG36ITR1K | USB Interface 36-WLCSP (2.1x2.1) | LIF-UC120-SWG36ITR1K.pdf | |
| AIB1CGML1-18-4SC | GT 4C 4#16 SKT RECP LINE | AIB1CGML1-18-4SC.pdf | |
| 172-E25-211-001 | 25 Position D-Sub Receptacle, Female Sockets Connector, Through Hole Solder | 172-E25-211-001.pdf | |
| 87113-4 | 4 Positions Header, Unshrouded Connector 0.156" (3.96mm) Through Hole Gold | 87113-4.pdf | |
| AT0805BRD072K61L | RES SMD 2.61K OHM 0.1% 1/8W 0805 | AT0805BRD072K61L.pdf | |
| PE2512FKM7W0R039L | RES SMD 0.039 OHM 1% 2W 2512 | PE2512FKM7W0R039L.pdf | |
| RAVF104DJT180K | RES ARRAY 4 RES 180K OHM 0804 | RAVF104DJT180K.pdf | |
| RN55D4930FB14 | RES 493 OHM 1/8W 1% AXIAL | RN55D4930FB14.pdf |