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| Manufacturer Part Number: | M2S100-FC1152 |
|---|---|
| Manufacturer: | Microsemi Corporation |
| Product Category: | Embedded - System On Chip (SoC) |
| Available Quantity: | 9010 Pieces |
| Unit Price: | Quote by Email |
| Description: | ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion®2 FPGA - 100K Logic Modules 512KB 64KB 166MHz 1152-FCBGA (35x35) |
| Lead Free Status / RoHS Status: | Contains lead / RoHS non-compliant |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Production Status (Lifecycle): | In Production |
| Delivery Time: | 1-2 Days |
| Date Code (D/C): | New |
| Datasheet Download: | M2S100-FC1152 Datasheet |
| Internal Part Number | 898-M2S100-FC1152 | |
| Manufacturer Lead time | 6-8 weeks | |
| Condition | New & Unused, Original Sealed | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - System On Chip (SoC) | |
| Manufacturer | Microsemi Corporation | |
| Series | SmartFusion®2 | |
| Packaging | Tray | |
| Part Status | Active | |
| Architecture | MCU, FPGA | |
| Core Processor | ARM® Cortex®-M3 | |
| MCU Flash | 512KB | |
| MCU RAM | 64KB | |
| Peripherals | DDR, PCIe, SERDES | |
| Connectivity | CAN, Ethernet, I²C, SPI, UART/USART, USB | |
| Speed | 166MHz | |
| Primary Attributes | FPGA - 100K Logic Modules | |
| Operating Temperature | 0°C ~ 85°C (TJ) | |
| Package / Case | 1152-BBGA, FCBGA | |
| Supplier Device Package | 1152-FCBGA (35x35) | |
| Number of I/O | 574 | |
| Standard Package | 24 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Replacement Part | M2S100-FC1152 | |
| Country of Origin | USA / JAPAN / Philippines / Malaysia | |
| MOQ | 1 Piece | |
| Picture / Image / Photo | Send via email | |
M2S100-FC1152 is in stock for immediate shipping now. We are the distributor of Microsemi Corporation all series components. The condition of M2S100-FC1152 is new and unused, you can buy M2S100-FC1152 Microsemi Corporation with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for M2S100-FC1152.
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