Manufacturer Part Number: | M2S090-1FG676I |
---|---|
Manufacturer: | Microsemi Corporation |
Product Category: | Embedded - System On Chip (SoC) |
Available Quantity: | 9010 Pieces |
Unit Price: | Quote by Email |
Description: | ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion®2 FPGA - 90K Logic Modules 512KB 64KB 166MHz 676-FBGA (27x27) |
Lead Free Status / RoHS Status: | Contains lead / RoHS non-compliant |
Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
Production Status (Lifecycle): | In Production |
Delivery Time: | 1-2 Days |
Date Code (D/C): | New |
Datasheet Download: | M2S090-1FG676I Datasheet |
Internal Part Number | 898-M2S090-1FG676I | |
Manufacturer Lead time | 6-8 weeks | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | Multiple Changes 17/Sep/2015 Lock Setting Chg 11/May/2016 Timing Chg 17/May/2016 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - System On Chip (SoC) | |
Manufacturer | Microsemi Corporation | |
Series | SmartFusion®2 | |
Packaging | Tray | |
Part Status | Active | |
Architecture | MCU, FPGA | |
Core Processor | ARM® Cortex®-M3 | |
MCU Flash | 512KB | |
MCU RAM | 64KB | |
Peripherals | DDR, PCIe, SERDES | |
Connectivity | CAN, Ethernet, I²C, SPI, UART/USART, USB | |
Speed | 166MHz | |
Primary Attributes | FPGA - 90K Logic Modules | |
Operating Temperature | -40°C ~ 100°C (TJ) | |
Package / Case | 676-BGA | |
Supplier Device Package | 676-FBGA (27x27) | |
Number of I/O | 425 | |
Standard Package | 40 | |
Weight | 0.001 KG | |
Application | Email for details | |
Replacement Part | M2S090-1FG676I | |
Country of Origin | USA / JAPAN / Philippines / Malaysia | |
MOQ | 1 Piece | |
Picture / Image / Photo | Send via email |
M2S090-1FG676I is in stock for immediate shipping now. We are the distributor of Microsemi Corporation all series components. The condition of M2S090-1FG676I is new and unused, you can buy M2S090-1FG676I Microsemi Corporation with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for M2S090-1FG676I.
MAL213696473E3 | 470µF 25V Aluminum Capacitors Radial, Can 5000 Hrs @ 105°C | MAL213696473E3.pdf | |
CC0603JRX7R9BB562 | 5600pF 50V Ceramic Capacitor X7R 0603 (1608 Metric) 0.063" L x 0.031" W (1.60mm x 0.80mm) | CC0603JRX7R9BB562.pdf | |
50357-5096J | 4 ROW VERT HDR CARD | 50357-5096J.pdf | |
ABM11DSAN | CONN EDGECARD 22POS R/A .156 SLD | ABM11DSAN.pdf | |
IRAMS06UP60A | Power Driver Module IGBT 3 Phase 600V 6A PCB Module | IRAMS06UP60A.pdf | |
MC9S08AC48CFDE | S08 S08 Microcontroller IC 8-Bit 40MHz 48KB (48K x 8) FLASH 48-QFN-EP (7x7) | MC9S08AC48CFDE.pdf | |
VI-J0X-CY-F4 | CONVERTER MOD DC/DC 5.2V 50W | VI-J0X-CY-F4.pdf | |
VE-BTW-IX-F2 | CONVERTER MOD DC/DC 5.5V 75W | VE-BTW-IX-F2.pdf | |
RJSNE508PA8 | Jack Modular Connector 8p8c (RJ45, Ethernet) 90° Angle (Right) Unshielded | RJSNE508PA8.pdf | |
0702800594 | 12 Positions Header, Unshrouded, Breakaway Connector 0.100" (2.54mm) Through Hole Tin | 0702800594.pdf | |
1797965 | 2 Position Wire to Board Terminal Block 40° (130°) Angle with Board 0.200" (5.08mm) Through Hole | 1797965.pdf | |
RG2012V-1651-W-T1 | RES SMD 1.65KOHM 0.05% 1/8W 0805 | RG2012V-1651-W-T1.pdf | |
YC102-FR-074K3L | RES ARRAY 2 RES 4.3K OHM 0302 | YC102-FR-074K3L.pdf |