| Manufacturer Part Number: | LFSCM3GA15EP1-6FN256I | 
|---|---|
| Manufacturer: | Lattice Semiconductor Corporation | 
| Product Category: | Embedded - FPGAs (Field Programmable Gate Array) | 
| Available Quantity: | 9010 Pieces | 
| Unit Price: | Quote by Email | 
| Description: | IC FPGA 139 I/O 256FBGA | 
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant | 
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) | 
| Production Status (Lifecycle): | In Production | 
| Delivery Time: | 1-2 Days | 
| Date Code (D/C): | New | 
| Datasheet Download: | LFSCM3GA15EP1-6FN256I Datasheet | 
| Internal Part Number | 898-LFSCM3GA15EP1-6FN256I | |
| Manufacturer Lead time | 6-8 weeks | |
| Condition | New & Unused, Original Sealed | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Manufacturer | Lattice Semiconductor Corporation | |
| Series | SCM | |
| Part Status | Active | |
| Number of LABs/CLBs | 3750 | |
| Number of Logic Elements/Cells | 15000 | |
| Total RAM Bits | 1054720 | |
| Number of I/O | 139 | |
| Number of Gates | - | |
| Voltage - Supply | 0.95 V ~ 1.26 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 105°C (TJ) | |
| Package / Case | 256-BGA | |
| Supplier Device Package | 256-FPBGA (17x17) | |
| Standard Package | 90 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Replacement Part | LFSCM3GA15EP1-6FN256I | |
| Country of Origin | USA / JAPAN / Philippines / Malaysia | |
| MOQ | 1 Piece | |
| Picture / Image / Photo | Send via email | |
LFSCM3GA15EP1-6FN256I is in stock for immediate shipping now. We are the distributor of Lattice Semiconductor Corporation all series components. The condition of LFSCM3GA15EP1-6FN256I is new and unused, you can buy LFSCM3GA15EP1-6FN256I Lattice Semiconductor Corporation with us at a very low price and quick delivery. 
Please kindly send us an email if you have any demands for LFSCM3GA15EP1-6FN256I.
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