Manufacturer Part Number: | KMPC850DECVR66BU |
---|---|
Manufacturer: | NXP Semiconductors |
Product Category: | Embedded - Microprocessors |
Available Quantity: | 9010 Pieces |
Unit Price: | Quote by Email |
Description: | MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 256-PBGA (23x23) |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
Production Status (Lifecycle): | Obsolete / Discontinued |
Delivery Time: | 1-2 Days |
Date Code (D/C): | New |
Datasheet Download: | KMPC850DECVR66BU Datasheet |
Internal Part Number | 898-KMPC850DECVR66BU | |
Manufacturer Lead time | 6-8 weeks | |
Condition | New & Unused, Original Sealed | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - Microprocessors | |
Manufacturer | Freescale Semiconductor - NXP | |
Series | MPC8xx | |
Packaging | Tray | |
Part Status | Obsolete | |
Core Processor | MPC8xx | |
Number of Cores/Bus Width | 1 Core, 32-Bit | |
Speed | 66MHz | |
Co-Processors/DSP | Communications; CPM | |
RAM Controllers | DRAM | |
Graphics Acceleration | No | |
Display & Interface Controllers | - | |
Ethernet | 10 Mbps (1) | |
SATA | - | |
USB | USB 1.x (1) | |
Voltage - I/O | 3.3V | |
Operating Temperature | -40°C ~ 95°C (TA) | |
Security Features | - | |
Package / Case | 256-BBGA | |
Supplier Device Package | 256-PBGA (23x23) | |
Additional Interfaces | HDLC/SDLC, I²C, IrDA, PCMCIA-ATA, TDM, UART/USART | |
Standard Package | 2 | |
Weight | 0.001 KG | |
Application | Email for details | |
Replacement Part | KMPC850DECVR66BU | |
Country of Origin | USA / JAPAN / Philippines / Malaysia | |
MOQ | 1 Piece | |
Picture / Image / Photo | Send via email |
KMPC850DECVR66BU is in stock for immediate shipping now. We are the distributor of NXP Semiconductors all series components. The condition of KMPC850DECVR66BU is new and unused, you can buy KMPC850DECVR66BU NXP Semiconductors with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for KMPC850DECVR66BU.
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