Stocking distributor of Electronic Components
Email: [email protected]
| Manufacturer Part Number: | IS64WV10248EDBLL-10CTLA3 |
|---|---|
| Manufacturer: | ISSI, Integrated Silicon Solution Inc |
| Product Category: | Memory |
| Available Quantity: | 9010 Pieces |
| Unit Price: | Quote by Email |
| Description: | IC SRAM 8MB 10NS 44TSOP |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Production Status (Lifecycle): | In Production |
| Delivery Time: | 1-2 Days |
| Date Code (D/C): | New |
| Datasheet Download: | IS64WV10248EDBLL-10CTLA3 Datasheet |
| Internal Part Number | 898-IS64WV10248EDBLL-10CTLA3 | |
| Manufacturer Lead time | 6-8 weeks | |
| Condition | New & Unused, Original Sealed | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Manufacturer | ISSI, Integrated Silicon Solution Inc | |
| Series | - | |
| Packaging | Tray | |
| Part Status | Active | |
| Format - Memory | RAM | |
| Memory Type | SRAM - Asynchronous | |
| Memory Size | 8M (1M x 8) | |
| Speed | 10ns | |
| Interface | Parallel | |
| Voltage - Supply | 2.4 V ~ 3.6 V | |
| Operating Temperature | -40°C ~ 125°C (TA) | |
| Package / Case | 44-TSOP (0.400", 10.16mm Width) | |
| Supplier Device Package | 44-TSOP II | |
| Standard Package | 135 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Replacement Part | IS64WV10248EDBLL-10CTLA3 | |
| Country of Origin | USA / JAPAN / Philippines / Malaysia | |
| MOQ | 1 Piece | |
| Picture / Image / Photo | Send via email | |
IS64WV10248EDBLL-10CTLA3 is in stock for immediate shipping now. We are the distributor of ISSI, Integrated Silicon Solution Inc all series components. The condition of IS64WV10248EDBLL-10CTLA3 is new and unused, you can buy IS64WV10248EDBLL-10CTLA3 ISSI, Integrated Silicon Solution Inc with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for IS64WV10248EDBLL-10CTLA3.
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