Manufacturer Part Number: | HM-H175B2-5BP1-TG30 |
---|---|
Manufacturer: | 3M |
Product Category: | Backplane Connectors - Hard Metric, Standard |
Available Quantity: | 9010 Pieces |
Unit Price: | Quote by Email |
Description: | 175 (125 + 50 Ground) Position Header, Male Pins Connector 0.079" (2.00mm) Through Hole |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
Production Status (Lifecycle): | In Production |
Delivery Time: | 1-2 Days |
Date Code (D/C): | New |
Datasheet Download: | HM-H175B2-5BP1-TG30 Datasheet |
Internal Part Number | 898-HM-H175B2-5BP1-TG30 | |
Manufacturer Lead time | 6-8 weeks | |
Condition | New & Unused, Original Sealed | |
3D Model | HM-H175B2-5BX1-XXXX.stp HM-H175B2-5BX1-XXXX.igs HM-H175B2-5BX1-XXXX.x_t | |
Category | Connectors, Interconnects | |
Family | Backplane Connectors - Hard Metric, Standard | |
Manufacturer | 3M | |
Series | MetPak™ HM | |
Packaging | Bulk | |
Part Status | Active | |
Connector Type | Header, Male Pins | |
Connector Style | B 25 | |
Number of Positions | 175 (125 + 50 Ground) | |
Number of Positions Loaded | All | |
Pitch | 0.079" (2.00mm) | |
Number of Rows | 5 | |
Mounting Type | Through Hole | |
Termination | Press-Fit | |
Connector Usage | - | |
Contact Finish | Gold | |
Contact Finish Thickness | 30µin (0.76µm) | |
Current Rating | 1A | |
Voltage Rating | - | |
Operating Temperature | -55°C ~ 125°C | |
Features | - | |
Standard Package | 100 | |
Weight | 0.001 KG | |
Application | Email for details | |
Replacement Part | HM-H175B2-5BP1-TG30 | |
Country of Origin | USA / JAPAN / Philippines / Malaysia | |
MOQ | 1 Piece | |
Picture / Image / Photo | Send via email |
HM-H175B2-5BP1-TG30 is in stock for immediate shipping now. We are the distributor of 3M all series components. The condition of HM-H175B2-5BP1-TG30 is new and unused, you can buy HM-H175B2-5BP1-TG30 3M with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for HM-H175B2-5BP1-TG30.
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