Stocking distributor of Electronic Components
Email: [email protected]
| Manufacturer Part Number: | HDAF-11-18.0-S-13-1 |
|---|---|
| Manufacturer: | Samtec Inc. |
| Product Category: | Rectangular - Board to Board Connectors - Arrays, Edge Type, Mezzanine |
| Available Quantity: | 9010 Pieces |
| Unit Price: | Quote by Email |
| Description: | 143 Position Connector High Density Array, Female Surface Mount Gold |
| Lead Free Status / RoHS Status: | Contains lead / RoHS non-compliant |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Production Status (Lifecycle): | In Production |
| Delivery Time: | 1-2 Days |
| Date Code (D/C): | New |
| Datasheet Download: | HDAF-11-18.0-S-13-1 Datasheet |
| Internal Part Number | 898-HDAF-11-18.0-S-13-1 | |
| Manufacturer Lead time | 6-8 weeks | |
| Condition | New & Unused, Original Sealed | |
| Category | Connectors, Interconnects | |
| Family | Rectangular - Board to Board Connectors - Arrays, Edge Type, Mezzanine | |
| Manufacturer | Samtec Inc. | |
| Series | HD Mezz™ HDAF | |
| Packaging | Tray | |
| Part Status | Active | |
| Connector Type | High Density Array, Female | |
| Number of Positions | 143 | |
| Pitch | 0.047" (1.20mm) | |
| Number of Rows | 13 | |
| Mounting Type | Surface Mount | |
| Features | Board Guide | |
| Contact Finish | Gold | |
| Contact Finish Thickness | 30µin (0.76µm) | |
| Mated Stacking Heights | 30mm, 35mm | |
| Height Above Board | 0.807" (20.51mm) | |
| Standard Package | 1 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Replacement Part | HDAF-11-18.0-S-13-1 | |
| Country of Origin | USA / JAPAN / Philippines / Malaysia | |
| MOQ | 1 Piece | |
| Picture / Image / Photo | Send via email | |
HDAF-11-18.0-S-13-1 is in stock for immediate shipping now. We are the distributor of Samtec Inc. all series components. The condition of HDAF-11-18.0-S-13-1 is new and unused, you can buy HDAF-11-18.0-S-13-1 Samtec Inc. with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for HDAF-11-18.0-S-13-1.
| VJ1812Y273JBCAT4X | 0.027µF 200V Ceramic Capacitor X7R 1812 (4532 Metric) 0.183" L x 0.126" W (4.65mm x 3.20mm) | VJ1812Y273JBCAT4X.pdf | |
| TH3D336K016C0600 | 33µF Molded Tantalum Capacitors 16V 2917 (7343 Metric) 600 mOhm 0.287" L x 0.169" W (7.30mm x 4.30mm) | TH3D336K016C0600.pdf | |
| 195D225X9025X2T | 2.2µF Conformal Coated Tantalum Capacitors 25V 2910 (7227 Metric) 0.285" L x 0.104" W (7.24mm x 2.65mm) | 195D225X9025X2T.pdf | |
| GEM18DRTS | CONN EDGECARD 36POS DIP .156 SLD | GEM18DRTS.pdf | |
| SIT8918BA-71-XXS-100.000000D | OSC XO 100MHZ ST | SIT8918BA-71-XXS-100.000000D.pdf | |
| MAD1107E3/TU | DIODE ARRAY 400MA 90V 14DIP | MAD1107E3/TU.pdf | |
| EX128-TQG64 | IC FPGA 46 I/O 64TQFP | EX128-TQG64.pdf | |
| ZGP323LSS2008G | Z8 Z8® GP™ Microcontroller IC 8-Bit 8MHz 8KB (8K x 8) OTP | ZGP323LSS2008G.pdf | |
| LJT00RT-17-25S-023 | LJT 24C 22#22D 2#8(COAX) SKT | LJT00RT-17-25S-023.pdf | |
| JT01RE12-98P-386 | JT 10C 10#20 PIN RECP | JT01RE12-98P-386.pdf | |
| TVP00DZ-17-8AB | TV 8C 8#16 PIN RECP | TVP00DZ-17-8AB.pdf | |
| 6-520353-2 | 12 Position FFC, FPC Connector Contacts, Top 0.100" (2.54mm) Through Hole, Right Angle | 6-520353-2.pdf | |
| 78208-409 | 9 Positions Header, Shrouded Connector 0.100" (2.54mm) Through Hole, Right Angle Tin | 78208-409.pdf | |
| MRS25000C5113FCT00 | RES 511K OHM 0.6W 1% AXIAL | MRS25000C5113FCT00.pdf |