Manufacturer Part Number: | HBM03DSEN |
---|---|
Manufacturer: | Sullins Connector Solutions |
Product Category: | Card Edge Connectors - Edgeboard Connectors |
Available Quantity: | 9010 Pieces |
Unit Price: | Quote by Email |
Description: | CONN EDGECARD 6POS .156 EYELET |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | |
Production Status (Lifecycle): | In Production |
Delivery Time: | 1-2 Days |
Date Code (D/C): | New |
Datasheet Download: | HBM03DSEN Datasheet |
Internal Part Number | 898-HBM03DSEN | |
Manufacturer Lead time | 6-8 weeks | |
Condition | New & Unused, Original Sealed | |
Category | Connectors, Interconnects | |
Family | Card Edge Connectors - Edgeboard Connectors | |
Manufacturer | Sullins Connector Solutions | |
Series | - | |
Packaging | Tray | |
Part Status | Active | |
Card Type | Non Specified - Dual Edge | |
Gender | Female | |
Number of Positions/Bay/Row | 3 | |
Number of Positions | 6 | |
Card Thickness | 0.062" (1.57mm) | |
Number of Rows | 2 | |
Pitch | 0.156" (3.96mm) | |
Features | - | |
Mounting Type | Free Hanging (In-Line) | |
Termination | Solder Eyelet(s) | |
Contact Material | Beryllium Copper | |
Contact Finish | Gold | |
Contact Finish Thickness | 10µin (0.25µm) | |
Contact Type | Full Bellows | |
Color | Blue | |
Flange Feature | - | |
Operating Temperature | -65°C ~ 125°C | |
Material - Insulation | Polybutylene Terephthalate (PBT) | |
Read Out | Dual | |
Standard Package | 1 | |
Weight | 0.001 KG | |
Application | Email for details | |
Replacement Part | HBM03DSEN | |
Country of Origin | USA / JAPAN / Philippines / Malaysia | |
MOQ | 1 Piece | |
Picture / Image / Photo | Send via email |
HBM03DSEN is in stock for immediate shipping now. We are the distributor of Sullins Connector Solutions all series components. The condition of HBM03DSEN is new and unused, you can buy HBM03DSEN Sullins Connector Solutions with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for HBM03DSEN.
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