Manufacturer Part Number: | HBM03DRKN |
---|---|
Manufacturer: | Sullins Connector Solutions |
Product Category: | Card Edge Connectors - Edgeboard Connectors |
Available Quantity: | 9010 Pieces |
Unit Price: | Quote by Email |
Description: | CONN EDGECARD 6POS DIP .156 SLD |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | |
Production Status (Lifecycle): | In Production |
Delivery Time: | 1-2 Days |
Date Code (D/C): | New |
Datasheet Download: | HBM03DRKN Datasheet |
Internal Part Number | 898-HBM03DRKN | |
Manufacturer Lead time | 6-8 weeks | |
Condition | New & Unused, Original Sealed | |
Category | Connectors, Interconnects | |
Family | Card Edge Connectors - Edgeboard Connectors | |
Manufacturer | Sullins Connector Solutions | |
Series | - | |
Packaging | Tray | |
Part Status | Active | |
Card Type | Non Specified - Dual Edge | |
Gender | Female | |
Number of Positions/Bay/Row | 3 | |
Number of Positions | 6 | |
Card Thickness | 0.062" (1.57mm) | |
Number of Rows | 2 | |
Pitch | 0.156" (3.96mm) | |
Features | - | |
Mounting Type | Through Hole | |
Termination | Solder | |
Contact Material | Beryllium Copper | |
Contact Finish | Gold | |
Contact Finish Thickness | 10µin (0.25µm) | |
Contact Type | Full Bellows | |
Color | Blue | |
Flange Feature | - | |
Operating Temperature | -65°C ~ 125°C | |
Material - Insulation | Polybutylene Terephthalate (PBT) | |
Read Out | Dual | |
Standard Package | 1 | |
Weight | 0.001 KG | |
Application | Email for details | |
Replacement Part | HBM03DRKN | |
Country of Origin | USA / JAPAN / Philippines / Malaysia | |
MOQ | 1 Piece | |
Picture / Image / Photo | Send via email |
HBM03DRKN is in stock for immediate shipping now. We are the distributor of Sullins Connector Solutions all series components. The condition of HBM03DRKN is new and unused, you can buy HBM03DRKN Sullins Connector Solutions with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for HBM03DRKN.
K271J10C0GH53L2 | 270pF 100V Ceramic Capacitor C0G, NP0 Radial 0.142" L x 0.091" W (3.60mm x 2.30mm) | K271J10C0GH53L2.pdf | |
CBR08C509A5GAC | 5pF 50V Ceramic Capacitor C0G, NP0 0805 (2012 Metric) 0.079" L x 0.049" W (2.00mm x 1.25mm) | CBR08C509A5GAC.pdf | |
HM66-30121LFTR13 | 120µH Shielded Wirewound Inductor 270mA 1.27 Ohm Max Nonstandard | HM66-30121LFTR13.pdf | |
EPM7128SQC160-15N | IC CPLD 128MC 15NS 160QFP | EPM7128SQC160-15N.pdf | |
M2S090-FG484I | ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion®2 FPGA - 90K Logic Modules 512KB 64KB 166MHz 484-FPBGA (23x23) | M2S090-FG484I.pdf | |
MC34PF3000A0EP | Processor PMIC 48-QFN (7x7) | MC34PF3000A0EP.pdf | |
VE-BN3-MX | CONVERTER MOD DC/DC 24V 75W | VE-BN3-MX.pdf | |
MCR10EZHF3093 | RES SMD 309K OHM 1% 1/8W 0805 | MCR10EZHF3093.pdf | |
L77TWA11W1SMCSVRM6 | 11 (10 + 1 Coax) Position D-Sub, Combo Receptacle, Female Sockets Connector, Through Hole, Right Angle Solder | L77TWA11W1SMCSVRM6.pdf | |
103308-5 | 20 Positions Header, Shrouded Connector 0.100" (2.54mm) Through Hole Gold or Gold-Palladium | 103308-5.pdf | |
20021112-00082T8LF | 82 Positions Header, Unshrouded Connector 0.050" (1.27mm) Through Hole, Right Angle Gold, GXT™ | 20021112-00082T8LF.pdf | |
RN60D3482FRSL | RES 34.8K OHM 1/4W 1% AXIAL | RN60D3482FRSL.pdf |