Manufacturer Part Number: | FK14X5R0J685K |
---|---|
Manufacturer: | TDK Corporation |
Product Category: | Ceramic Capacitors |
Available Quantity: | 9010 Pieces |
Unit Price: | Quote by Email |
Description: | 6.8µF 6.3V Ceramic Capacitor X5R Radial 0.177" L x 0.098" W (4.50mm x 2.50mm) |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
Production Status (Lifecycle): | In Production |
Delivery Time: | 1-2 Days |
Date Code (D/C): | New |
Datasheet Download: | FK14X5R0J685K Datasheet |
Internal Part Number | 898-FK14X5R0J685K | |
Manufacturer Lead time | 6-8 weeks | |
Condition | New & Unused, Original Sealed | |
Featured Product | FK Series Capacitors | |
PCN Obsolescence/ EOL | Multiple Devices 22/Apr/2016 | |
EDA / CAD Models | Download from Accelerated Designs | |
Category | Capacitors | |
Family | Ceramic Capacitors | |
Manufacturer | TDK Corporation | |
Series | FK | |
Packaging | Bulk | |
Part Status | End of Life | |
Capacitance | 6.8µF | |
Tolerance | ±10% | |
Voltage - Rated | 6.3V | |
Temperature Coefficient | X5R | |
Mounting Type | Through Hole | |
Operating Temperature | -55°C ~ 85°C | |
Applications | General Purpose | |
Ratings | - | |
Package / Case | Radial | |
Size / Dimension | 0.177" L x 0.098" W (4.50mm x 2.50mm) | |
Height - Seated (Max) | 0.217" (5.50mm) | |
Thickness (Max) | - | |
Lead Spacing | 0.098" (2.50mm) | |
Features | - | |
Lead Style | Formed Leads | |
Standard Package | 500 | |
Weight | 0.001 KG | |
Application | Email for details | |
Replacement Part | FK14X5R0J685K | |
Country of Origin | USA / JAPAN / Philippines / Malaysia | |
MOQ | 1 Piece | |
Picture / Image / Photo | Send via email |
FK14X5R0J685K is in stock for immediate shipping now. We are the distributor of TDK Corporation all series components. The condition of FK14X5R0J685K is new and unused, you can buy FK14X5R0J685K TDK Corporation with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for FK14X5R0J685K.
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