| Manufacturer Part Number: | FA14NP01H223JNU06 |
|---|---|
| Manufacturer: | TDK Corporation |
| Product Category: | Ceramic Capacitors |
| Available Quantity: | 9010 Pieces |
| Unit Price: | Quote by Email |
| Description: | 0.022µF 50V Ceramic Capacitor C0G, NP0 Radial 0.177" L x 0.118" W (4.50mm x 3.00mm) |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Production Status (Lifecycle): | In Production |
| Delivery Time: | 1-2 Days |
| Date Code (D/C): | New |
| Datasheet Download: | FA14NP01H223JNU06 Datasheet |
| Internal Part Number | 898-FA14NP01H223JNU06 | |
| Manufacturer Lead time | 6-8 weeks | |
| Condition | New & Unused, Original Sealed | |
| Category | Capacitors | |
| Family | Ceramic Capacitors | |
| Manufacturer | TDK Corporation | |
| Series | FA | |
| Packaging | Tape & Box (TB) | |
| Part Status | Active | |
| Capacitance | 0.022µF | |
| Tolerance | ±5% | |
| Voltage - Rated | 50V | |
| Temperature Coefficient | C0G, NP0 | |
| Mounting Type | Through Hole | |
| Operating Temperature | -55°C ~ 150°C | |
| Applications | Automotive | |
| Ratings | AEC-Q200 | |
| Package / Case | Radial | |
| Size / Dimension | 0.177" L x 0.118" W (4.50mm x 3.00mm) | |
| Height - Seated (Max) | 0.217" (5.50mm) | |
| Thickness (Max) | - | |
| Lead Spacing | 0.098" (2.50mm) | |
| Features | High Temperature | |
| Lead Style | Formed Leads | |
| Standard Package | 2,000 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Replacement Part | FA14NP01H223JNU06 | |
| Country of Origin | USA / JAPAN / Philippines / Malaysia | |
| MOQ | 1 Piece | |
| Picture / Image / Photo | Send via email | |
FA14NP01H223JNU06 is in stock for immediate shipping now. We are the distributor of TDK Corporation all series components. The condition of FA14NP01H223JNU06 is new and unused, you can buy FA14NP01H223JNU06 TDK Corporation with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for FA14NP01H223JNU06.
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