Manufacturer Part Number: | F971D226MCC |
---|---|
Manufacturer: | Nichicon |
Product Category: | Tantalum Capacitors |
Available Quantity: | 13010 Pieces |
Unit Price: | Quote by Email |
Description: | 22µF Molded Tantalum Capacitors 20V 2312 (6032 Metric) 1.1 Ohm 0.236" L x 0.126" W (6.00mm x 3.20mm) |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
Production Status (Lifecycle): | In Production |
Delivery Time: | 1-2 Days |
Date Code (D/C): | New |
Datasheet Download: | F971D226MCC Datasheet |
Internal Part Number | 898-F971D226MCC | |
Manufacturer Lead time | 6-8 weeks | |
Condition | New & Unused, Original Sealed | |
Product Training Modules | Nichicon Tantalum Cap Overview | |
PCN Manufacturer Information | AVX Acquires Nichicon's Tantalum Division | |
Online Catalog | F97 Series | |
Category | Capacitors | |
Family | Tantalum Capacitors | |
Manufacturer | Nichicon | |
Series | F97 | |
Packaging | Tape & Reel (TR) | |
Part Status | Active | |
Capacitance | 22µF | |
Tolerance | ±20% | |
Voltage - Rated | 20V | |
ESR (Equivalent Series Resistance) | 1.1 Ohm | |
Type | Molded | |
Operating Temperature | -55°C ~ 125°C | |
Mounting Type | Surface Mount | |
Package / Case | 2312 (6032 Metric) | |
Size / Dimension | 0.236" L x 0.126" W (6.00mm x 3.20mm) | |
Height - Seated (Max) | 0.106" (2.70mm) | |
Lead Spacing | - | |
Manufacturer Size Code | C | |
Features | High Reliability | |
Lifetime @ Temp. | - | |
Standard Package | 500 | |
Weight | 0.001 KG | |
Application | Email for details | |
Replacement Part | F971D226MCC | |
Country of Origin | USA / JAPAN / Philippines / Malaysia | |
MOQ | 1 Piece | |
Picture / Image / Photo | Send via email |
F971D226MCC is in stock for immediate shipping now. We are the distributor of Nichicon all series components. The condition of F971D226MCC is new and unused, you can buy F971D226MCC Nichicon with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for F971D226MCC.
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