Stocking distributor of Electronic Components
Email: [email protected]
| Manufacturer Part Number: | DSPIC33FJ32GS606-E/MR |
|---|---|
| Manufacturer: | Microchip Technology |
| Product Category: | Embedded - Microcontrollers |
| Available Quantity: | 9010 Pieces |
| Unit Price: | Quote by Email |
| Description: | dsPIC dsPIC™ 33F Microcontroller IC 16-Bit 40 MIPs 32KB (32K x 8) FLASH 64-QFN (9x9) |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Production Status (Lifecycle): | In Production |
| Delivery Time: | 1-2 Days |
| Date Code (D/C): | New |
| Datasheet Download: | DSPIC33FJ32GS606-E/MR Datasheet |
| Internal Part Number | 898-DSPIC33FJ32GS606-E/MR | |
| Manufacturer Lead time | 6-8 weeks | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | Interleaved Power Factor Correction Bluetooth Audio Development Platform | |
| Design Resources | Development Tool Selector | |
| PCN Design/Specification | DSPIC33FJyyGS Datasheet Update 17/Jul/2014 Errata Update 22/Oct/2014 Mold Compound Update 31/Oct/2014 Errata/Datasheet Update 28/Jan/2015 New DeviceDoc 09/Feb/2016 | |
| PCN Assembly/Origin | Assembly Site Addition 22/Jun/2015 | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Manufacturer | Microchip Technology | |
| Series | dsPIC™ 33F | |
| Packaging | Tube | |
| Part Status | Active | |
| Core Processor | dsPIC | |
| Core Size | 16-Bit | |
| Speed | 40 MIPs | |
| Connectivity | I²C, IrDA, LIN, SPI, UART/USART | |
| Peripherals | Brown-out Detect/Reset, QEI, POR, PWM, WDT | |
| Number of I/O | 58 | |
| Program Memory Size | 32KB (32K x 8) | |
| Program Memory Type | FLASH | |
| EEPROM Size | - | |
| RAM Size | 4K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 3 V ~ 3.6 V | |
| Data Converters | A/D 16x10b; D/A 1x10b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 125°C (TA) | |
| Package / Case | 64-VFQFN Exposed Pad | |
| Supplier Device Package | 64-QFN (9x9) | |
| Standard Package | 40 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Replacement Part | DSPIC33FJ32GS606-E/MR | |
| Country of Origin | USA / JAPAN / Philippines / Malaysia | |
| MOQ | 1 Piece | |
| Picture / Image / Photo | Send via email | |
DSPIC33FJ32GS606-E/MR is in stock for immediate shipping now. We are the distributor of Microchip Technology all series components. The condition of DSPIC33FJ32GS606-E/MR is new and unused, you can buy DSPIC33FJ32GS606-E/MR Microchip Technology with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for DSPIC33FJ32GS606-E/MR.
| CL21B106KQQNNNF | 10µF 6.3V Ceramic Capacitor X7R 0805 (2012 Metric) 0.079" L x 0.049" W (2.00mm x 1.25mm) | CL21B106KQQNNNF.pdf | |
| BFC241903003 | Film Capacitor Polypropylene (PP), Metallized Radial 0.492" L x 0.158" W (12.50mm x 4.00mm) | BFC241903003.pdf | |
| 0877004.MXEP | FUSE CERAMIC 4A 250VAC AXIAL | 0877004.MXEP.pdf | |
| 51732-039LF | R/A HDR PWRBLADE | 51732-039LF.pdf | |
| RCM12DCCT | CONN EDGECARD 24POS R/A .156 SLD | RCM12DCCT.pdf | |
| AMC06DTAD | CONN EDGECARD 12POS .100" | AMC06DTAD.pdf | |
| VE-B1F-IU-F3 | CONVERTER MOD DC/DC 72V 200W | VE-B1F-IU-F3.pdf | |
| L77TWB17W2SEP3SV | 17 (15 + 2 Power) Position D-Sub, Combo Receptacle, Female Sockets Connector, Through Hole, Right Angle Solder | L77TWB17W2SEP3SV.pdf | |
| 5047402300 | 23 Position FPC Connector Contacts, Top and Bottom 0.012" (0.30mm) Surface Mount, Right Angle | 5047402300.pdf | |
| 1718141008 | 8 Positions Header, Unshrouded Connector 0.156" (3.96mm) Through Hole, Right Angle Gold | 1718141008.pdf | |
| PE2512JKF7W0R008L | RES SMD 0.008 OHM 5% 2W 2512 | PE2512JKF7W0R008L.pdf | |
| RT0805BRB0721KL | RES SMD 21K OHM 0.1% 1/8W 0805 | RT0805BRB0721KL.pdf | |
| CB3JBR510 | RES .51 OHM 3W 5% CERAMIC WW | CB3JBR510.pdf |