| Manufacturer Part Number: | DSPIC33FJ16GS504-E/ML |
|---|---|
| Manufacturer: | Microchip Technology |
| Product Category: | Embedded - Microcontrollers |
| Available Quantity: | 9010 Pieces |
| Unit Price: | Quote by Email |
| Description: | dsPIC dsPIC™ 33F Microcontroller IC 16-Bit 40 MIPs 16KB (16K x 8) FLASH 44-QFN (8x8) |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Production Status (Lifecycle): | In Production |
| Delivery Time: | 1-2 Days |
| Date Code (D/C): | New |
| Datasheet Download: | DSPIC33FJ16GS504-E/ML Datasheet |
| Internal Part Number | 898-DSPIC33FJ16GS504-E/ML | |
| Manufacturer Lead time | 6-8 weeks | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | Interleaved Power Factor Correction Bluetooth Audio Development Platform | |
| Design Resources | Development Tool Selector | |
| PCN Design/Specification | Plating 04/Jun/2013 Errata Document Revision 27/Sep/2013 Datasheet Update 15/May/2014 Errata/Datasheet Update 24/Oct/2014 Errata/Datasheet Update 05/Feb/2015 New DeviceDoc 04/Feb/2016 New DeviceDoc 25/Apr/2016 | |
| PCN Assembly/Origin | Qualification Assembly Site 01/May/2014 Qualification Report 01/Jul/2014 | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Manufacturer | Microchip Technology | |
| Series | dsPIC™ 33F | |
| Packaging | Tube | |
| Part Status | Active | |
| Core Processor | dsPIC | |
| Core Size | 16-Bit | |
| Speed | 40 MIPs | |
| Connectivity | I²C, IrDA, LIN, SPI, UART/USART | |
| Peripherals | Brown-out Detect/Reset, POR, PWM, WDT | |
| Number of I/O | 35 | |
| Program Memory Size | 16KB (16K x 8) | |
| Program Memory Type | FLASH | |
| EEPROM Size | - | |
| RAM Size | 2K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 3 V ~ 3.6 V | |
| Data Converters | A/D 24x10b, D/A 4x10b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 125°C (TA) | |
| Package / Case | 44-VQFN Exposed Pad | |
| Supplier Device Package | 44-QFN (8x8) | |
| Standard Package | 45 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Replacement Part | DSPIC33FJ16GS504-E/ML | |
| Country of Origin | USA / JAPAN / Philippines / Malaysia | |
| MOQ | 1 Piece | |
| Picture / Image / Photo | Send via email | |
DSPIC33FJ16GS504-E/ML is in stock for immediate shipping now. We are the distributor of Microchip Technology all series components. The condition of DSPIC33FJ16GS504-E/ML is new and unused, you can buy DSPIC33FJ16GS504-E/ML Microchip Technology with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for DSPIC33FJ16GS504-E/ML.
| SIT8008AC-13-33E-14.745600D | OSC XO 3.3V 14.7456MHZ OE | SIT8008AC-13-33E-14.745600D.pdf | |
| IHSM4825RE1R0L | 1µH Unshielded Inductor 8.6A 13 mOhm Max Nonstandard | IHSM4825RE1R0L.pdf | |
| PIC16F1829-I/SO | PIC PIC® XLP™ mTouch™ 16F Microcontroller IC 8-Bit 32MHz 14KB (8K x 14) FLASH 20-SOIC | PIC16F1829-I/SO.pdf | |
| MC74HC10ADR2G | NAND Gate IC 3 Channel 14-SOIC | MC74HC10ADR2G.pdf | |
| HLMP-RL11-LP0DD | Amber 592nm LED Indication - Discrete 2.15V Radial | HLMP-RL11-LP0DD.pdf | |
| V24A6V5C400B3 | CONVERTER MOD DC/DC 6.5V 400W | V24A6V5C400B3.pdf | |
| FMM11DSEH-S243 | CONN EDGECARD 22POS .156 EYELET | FMM11DSEH-S243.pdf | |
| 78511-118HLF | 18 Positions Header, Unshrouded Connector 0.100" (2.54mm) Through Hole Gold or Gold, GXT™ | 78511-118HLF.pdf | |
| 861400361YO2444 | 36 Positions Header, Unshrouded Connector 0.100" (2.54mm) Through Hole Gold or Gold, GXT™ | 861400361YO2444.pdf | |
| OSTHE095040 | 9 Position Wire to Board Terminal Block 45° (135°) Angle with Board 0.100" (2.54mm) Through Hole | OSTHE095040.pdf |