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DSPIC33EP256MU814T-I/PL

DSPIC33EP256MU814T-I/PL
Manufacturer Part Number:DSPIC33EP256MU814T-I/PL
Manufacturer:
Product Category:Embedded - Microcontrollers
Available Quantity:9010 Pieces
Unit Price:Quote by Email
Description:dsPIC dsPIC™ 33EP Microcontroller IC 16-Bit 60 MIPs 256KB (85.5K x 24) FLASH 144-LQFP (20x20)
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL):3 (168 Hours)
Production Status (Lifecycle):In Production
Delivery Time:1-2 Days
Date Code (D/C):New
Datasheet Download: DSPIC33EP256MU814T-I/PL Datasheet
DSPIC33EP256MU814T-I/PL´s Parameters
Internal Part Number898-DSPIC33EP256MU814T-I/PL
Manufacturer Lead time6-8 weeks
ConditionNew & Unused, Original Sealed
Design ResourcesDevelopment Tool Selector
PCN Design/SpecificationdsPic33EPXXX, PIC24EPXXX Errata Doc Rev 4/Nov/2015
PCN PackagingLabel and Packing Changes 23/Sep/2015
CategoryIntegrated Circuits (ICs)
FamilyEmbedded - Microcontrollers
ManufacturerMicrochip Technology
SeriesdsPIC™ 33EP
PackagingTape & Reel (TR)
Part StatusActive
Core ProcessordsPIC
Core Size16-Bit
Speed60 MIPs
ConnectivityCAN, I²C, IrDA, LIN, QEI, SPI, UART/USART, USB OTG
PeripheralsBrown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O122
Program Memory Size256KB (85.5K x 24)
Program Memory TypeFLASH
EEPROM Size-
RAM Size12K x 16
Voltage - Supply (Vcc/Vdd)3 V ~ 3.6 V
Data ConvertersA/D 32x10b/12b
Oscillator TypeInternal
Operating Temperature-40°C ~ 85°C (TA)
Package / Case144-LQFP
Supplier Device Package144-LQFP (20x20)
Standard Package 700
Weight0.001 KG
ApplicationEmail for details
Replacement PartDSPIC33EP256MU814T-I/PL
Country of OriginUSA / JAPAN / Philippines / Malaysia
MOQ1 Piece
Picture / Image / PhotoSend via email

DSPIC33EP256MU814T-I/PL is in stock for immediate shipping now. We are the distributor of Microchip Technology all series components. The condition of DSPIC33EP256MU814T-I/PL is new and unused, you can buy DSPIC33EP256MU814T-I/PL Microchip Technology with us at a very low price and quick delivery.

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