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| Manufacturer Part Number: | CY7C2270KV18-550BZXC |
|---|---|
| Manufacturer: | Cypress Semiconductor Corp |
| Product Category: | Memory |
| Available Quantity: | 9136 Pieces |
| Unit Price: | Quote by Email |
| Description: | IC SRAM 36MBIT 550MHZ 165FBGA |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Production Status (Lifecycle): | In Production |
| Delivery Time: | 1-2 Days |
| Date Code (D/C): | New |
| Datasheet Download: | CY7C2270KV18-550BZXC Datasheet |
| Internal Part Number | 898-CY7C2270KV18-550BZXC | |
| Manufacturer Lead time | 6-8 weeks | |
| Condition | New & Unused, Original Sealed | |
| Featured Product | QDR-II+ and DDR-II+ Xtreme SRAMs | |
| PCN Assembly/Origin | Qualification of Die Attach Film 13/Dec/2013 Assembly Site Add 08/Oct/2015 | |
| PCN Other | Multiple Updates 27/Mar/2015 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Manufacturer | Cypress Semiconductor Corp | |
| Series | - | |
| Packaging | Tray | |
| Part Status | Active | |
| Format - Memory | RAM | |
| Memory Type | SRAM - Synchronous, DDR II+ | |
| Memory Size | 36M (1M x 36) | |
| Speed | 550MHz | |
| Interface | Parallel | |
| Voltage - Supply | 1.7 V ~ 1.9 V | |
| Operating Temperature | 0°C ~ 70°C (TA) | |
| Package / Case | 165-LBGA | |
| Supplier Device Package | 165-FBGA (13x15) | |
| Standard Package | 136 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Replacement Part | CY7C2270KV18-550BZXC | |
| Country of Origin | USA / JAPAN / Philippines / Malaysia | |
| MOQ | 1 Piece | |
| Picture / Image / Photo | Send via email | |
CY7C2270KV18-550BZXC is in stock for immediate shipping now. We are the distributor of Cypress Semiconductor Corp all series components. The condition of CY7C2270KV18-550BZXC is new and unused, you can buy CY7C2270KV18-550BZXC Cypress Semiconductor Corp with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for CY7C2270KV18-550BZXC.
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