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| Manufacturer Part Number: | CRGV2010F1M3 |
|---|---|
| Manufacturer: | TE Connectivity Potter & Brumfield Relays |
| Product Category: | Chip Resistor - Surface Mount |
| Available Quantity: | 9010 Pieces |
| Unit Price: | Quote by Email |
| Description: | RES SMD 1.3M OHM 1% 1/2W 2010 |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Production Status (Lifecycle): | In Production |
| Delivery Time: | 1-2 Days |
| Date Code (D/C): | New |
| Datasheet Download: | CRGV2010F1M3 Datasheet |
| Internal Part Number | 898-CRGV2010F1M3 | |
| Manufacturer Lead time | 6-8 weeks | |
| Condition | New & Unused, Original Sealed | |
| RoHS Information | 3-1879537-7 Statement of Compliance RoHS 2 Statement | |
| Category | Resistors | |
| Family | Chip Resistor - Surface Mount | |
| Manufacturer | TE Connectivity AMP Connectors | |
| Series | CRGV, Neohm | |
| Packaging | Tape & Reel (TR) | |
| Part Status | Active | |
| Resistance (Ohms) | 1.3M | |
| Tolerance | ±1% | |
| Power (Watts) | 0.5W, 1/2W | |
| Composition | Thick Film | |
| Features | - | |
| Temperature Coefficient | ±200ppm/°C | |
| Operating Temperature | -55°C ~ 125°C | |
| Package / Case | 2010 (5025 Metric) | |
| Supplier Device Package | 2010 | |
| Size / Dimension | 0.197" L x 0.098" W (5.00mm x 2.50mm) | |
| Height | - | |
| Number of Terminations | 2 | |
| Standard Package | 20,000 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Replacement Part | CRGV2010F1M3 | |
| Country of Origin | USA / JAPAN / Philippines / Malaysia | |
| MOQ | 1 Piece | |
| Picture / Image / Photo | Send via email | |
CRGV2010F1M3 is in stock for immediate shipping now. We are the distributor of TE Connectivity Potter & Brumfield Relays all series components. The condition of CRGV2010F1M3 is new and unused, you can buy CRGV2010F1M3 TE Connectivity Potter & Brumfield Relays with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for CRGV2010F1M3.
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