Manufacturer Part Number: | CPF-A-0805B3K9E |
---|---|
Manufacturer: | TE Connectivity AMP Connectors |
Product Category: | Chip Resistor - Surface Mount |
Available Quantity: | 19010 Pieces |
Unit Price: | Quote by Email |
Description: | RES SMD 3.9K OHM 0.1% 1/10W 0805 |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
Production Status (Lifecycle): | In Production |
Delivery Time: | 1-2 Days |
Date Code (D/C): | New |
Datasheet Download: | CPF-A-0805B3K9E Datasheet |
Internal Part Number | 898-CPF-A-0805B3K9E | |
Manufacturer Lead time | 6-8 weeks | |
Condition | New & Unused, Original Sealed | |
Featured Product | Automotive Grade Thin Film Chip Resistors | |
Online Catalog | CPF-A, Neohm Series | |
Category | Resistors | |
Family | Chip Resistor - Surface Mount | |
Manufacturer | TE Connectivity AMP Connectors | |
Series | CPF-A, Neohm | |
Packaging | Cut Tape (CT) | |
Part Status | Active | |
Resistance (Ohms) | 3.9k | |
Tolerance | ±0.1% | |
Power (Watts) | 0.1W, 1/10W | |
Composition | Thin Film | |
Features | Anti-Sulfur, Automotive AEC-Q200, Moisture Resistant | |
Temperature Coefficient | ±25ppm/°C | |
Operating Temperature | -55°C ~ 155°C | |
Package / Case | 0805 (2012 Metric) | |
Supplier Device Package | 0805 | |
Size / Dimension | 0.079" L x 0.049" W (2.00mm x 1.25mm) | |
Height | 0.026" (0.65mm) | |
Number of Terminations | 2 | |
Standard Package | 1 | |
Weight | 0.001 KG | |
Application | Email for details | |
Replacement Part | CPF-A-0805B3K9E | |
Country of Origin | USA / JAPAN / Philippines / Malaysia | |
MOQ | 1 Piece | |
Picture / Image / Photo | Send via email |
CPF-A-0805B3K9E is in stock for immediate shipping now. We are the distributor of TE Connectivity AMP Connectors all series components. The condition of CPF-A-0805B3K9E is new and unused, you can buy CPF-A-0805B3K9E TE Connectivity AMP Connectors with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for CPF-A-0805B3K9E.
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