Manufacturer Part Number: | CP2-HB110-GA4-GG30 |
---|---|
Manufacturer: | 3M |
Product Category: | Backplane Connectors - Hard Metric, Standard |
Available Quantity: | 9010 Pieces |
Unit Price: | Quote by Email |
Description: | 154 (110 + 44 Ground) Position Header, Male Pins Connector 0.079" (2.00mm) Through Hole |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
Production Status (Lifecycle): | Obsolete / Discontinued |
Delivery Time: | 1-2 Days |
Date Code (D/C): | New |
Datasheet Download: | CP2-HB110-GA4-GG30 Datasheet |
Internal Part Number | 898-CP2-HB110-GA4-GG30 | |
Manufacturer Lead time | 6-8 weeks | |
Condition | New & Unused, Original Sealed | |
PCN Obsolescence/ EOL | CP2 Tin-Lead Plated 01/Oct/2012 | |
Category | Connectors, Interconnects | |
Family | Backplane Connectors - Hard Metric, Standard | |
Manufacturer | 3M | |
Series | MetPak™ CP2 | |
Packaging | Bulk | |
Part Status | Obsolete | |
Connector Type | Header, Male Pins | |
Connector Style | B 22 | |
Number of Positions | 154 (110 + 44 Ground) | |
Number of Positions Loaded | All | |
Pitch | 0.079" (2.00mm) | |
Number of Rows | 5 + 2 | |
Mounting Type | Through Hole | |
Termination | Press-Fit | |
Connector Usage | CompactPCI Hot Swap | |
Contact Finish | Gold | |
Contact Finish Thickness | 30µin (0.76µm) | |
Current Rating | - | |
Voltage Rating | - | |
Operating Temperature | -40°C ~ 85°C | |
Features | - | |
Standard Package | 1,024 | |
Weight | 0.001 KG | |
Application | Email for details | |
Replacement Part | CP2-HB110-GA4-GG30 | |
Country of Origin | USA / JAPAN / Philippines / Malaysia | |
MOQ | 1 Piece | |
Picture / Image / Photo | Send via email |
CP2-HB110-GA4-GG30 is in stock for immediate shipping now. We are the distributor of 3M all series components. The condition of CP2-HB110-GA4-GG30 is new and unused, you can buy CP2-HB110-GA4-GG30 3M with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for CP2-HB110-GA4-GG30.
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