Manufacturer Part Number: | BBS-106-T-A |
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Manufacturer: | Samtec Inc. |
Product Category: | Rectangular - Board to Board Connectors - Headers, Male Pins |
Available Quantity: | 9010 Pieces |
Unit Price: | Quote by Email |
Description: | CONN HEADER 6POS .100 PCB TIN |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
Production Status (Lifecycle): | In Production |
Delivery Time: | 1-2 Days |
Date Code (D/C): | New |
Datasheet Download: | BBS-106-T-A Datasheet |
Internal Part Number | 898-BBS-106-T-A | |
Manufacturer Lead time | 6-8 weeks | |
Condition | New & Unused, Original Sealed | |
Product Training Modules | Board-to-Board Connectors | |
Featured Product | Board-To-Board Interconnect Systems | |
EDA / CAD Models | Download from Accelerated Designs | |
Category | Connectors, Interconnects | |
Family | Rectangular - Board to Board Connectors - Headers, Male Pins | |
Manufacturer | Samtec Inc. | |
Series | BBS | |
Packaging | Bulk | |
Part Status | Discontinued | |
Connector Type | Unshrouded | |
Number of Positions | 6 | |
Number of Positions Loaded | All | |
Pitch | 0.100" (2.54mm) | |
Number of Rows | 1 | |
Row Spacing | - | |
Height Stacking (Mating) | - | |
Molding Height Above Board | 0.210" (5.33mm) | |
Contact Mating Length | 0.125" (3.18mm) | |
Mounting Type | Through Hole | |
Termination | Solder | |
Contact Finish | Tin | |
Contact Finish Thickness | - | |
Features | - | |
Color | Black | |
Standard Package | 1 | |
Weight | 0.001 KG | |
Application | Email for details | |
Replacement Part | BBS-106-T-A | |
Country of Origin | USA / JAPAN / Philippines / Malaysia | |
MOQ | 1 Piece | |
Picture / Image / Photo | Send via email |
BBS-106-T-A is in stock for immediate shipping now. We are the distributor of Samtec Inc. all series components. The condition of BBS-106-T-A is new and unused, you can buy BBS-106-T-A Samtec Inc. with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for BBS-106-T-A.
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