Stocking distributor of Electronic Components
Email: [email protected]
| Manufacturer Part Number: | A3P600-2FGG484 |
|---|---|
| Manufacturer: | Microsemi Corporation |
| Product Category: | Embedded - FPGAs (Field Programmable Gate Array) |
| Available Quantity: | 9010 Pieces |
| Unit Price: | Quote by Email |
| Description: | IC FPGA 235 I/O 484FBGA |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Production Status (Lifecycle): | In Production |
| Delivery Time: | 1-2 Days |
| Date Code (D/C): | New |
| Datasheet Download: | A3P600-2FGG484 Datasheet |
| Internal Part Number | 898-A3P600-2FGG484 | |
| Manufacturer Lead time | 6-8 weeks | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Gold to Palladium Coated Copper Wire Chg 5/Nov/2015 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Manufacturer | Microsemi Corporation | |
| Series | ProASIC3 | |
| Part Status | Active | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | - | |
| Total RAM Bits | 110592 | |
| Number of I/O | 235 | |
| Number of Gates | 600000 | |
| Voltage - Supply | 1.425 V ~ 1.575 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 85°C (TJ) | |
| Package / Case | 484-BGA | |
| Supplier Device Package | 484-FPBGA (23x23) | |
| Standard Package | 1 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Replacement Part | A3P600-2FGG484 | |
| Country of Origin | USA / JAPAN / Philippines / Malaysia | |
| MOQ | 1 Piece | |
| Picture / Image / Photo | Send via email | |
A3P600-2FGG484 is in stock for immediate shipping now. We are the distributor of Microsemi Corporation all series components. The condition of A3P600-2FGG484 is new and unused, you can buy A3P600-2FGG484 Microsemi Corporation with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for A3P600-2FGG484.
| VJ0402A220JNAAI | 22pF 50V Ceramic Capacitor C0G, NP0 0402 (1005 Metric) 0.039" L x 0.020" W (1.00mm x 0.50mm) | VJ0402A220JNAAI.pdf | |
| T520T336M008ATE070 | 33µF Molded Tantalum - Polymer Capacitors 8V 1411 (3528 Metric) 70 mOhm 0.138" L x 0.110" W (3.50mm x 2.80mm) | T520T336M008ATE070.pdf | |
| 3403.0170.11 | FUSE BRD MNT 2.5A 250VAC 125VDC | 3403.0170.11.pdf | |
| PDTC123YT,215 | TRANS PREBIAS NPN 250MW TO236AB | PDTC123YT,215.pdf | |
| CLS4D14-6R8NC | 6.8µH Unshielded Inductor 1A 130 mOhm Max Nonstandard | CLS4D14-6R8NC.pdf | |
| 4470-38J | 1.2mH Unshielded Molded Inductor 137mA 27 Ohm Max Axial | 4470-38J.pdf | |
| EP3C55U484C8N | IC FPGA 327 I/O 484UBGA | EP3C55U484C8N.pdf | |
| SN74STV16857DGGRG4 | IC REG BUFF 14BIT SSTL 48-TSSOP | SN74STV16857DGGRG4.pdf | |
| CY7C1425JV18-250BZI | IC SRAM 36MBIT 250MHZ 165FBGA | CY7C1425JV18-250BZI.pdf | |
| 924527-28-20-EU | 40 Positions Header, Unshrouded Connector 0.100" (2.54mm) Through Hole Gold | 924527-28-20-EU.pdf | |
| RG3216N-6200-B-T1 | RES SMD 620 OHM 0.1% 1/4W 1206 | RG3216N-6200-B-T1.pdf |